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Transmitting signals in an IoT PCB

Effectively transmitting electronic signals in an IoT product relies heavily on how device packaging, traces, routing and vias are designed in IoT rigid-flex or flex circuitry. Component or device packaging includes micro ball grid arrays (micro BGAs), quad-flat no-leads (QFN) and dual-flat no-leads (DFN). These electronic device packages are less than the size of a […]

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Fill Up Through Holes in IoT Rigid-Flex and Flex Circuits

Requirements for Class III IoT devices are very specific. IoT applications falling into this category include mil/aero and medical electronics. In the assembly process for any type of PCB, either surface mount technology or through hole is used to place components onto an IoT rigid-flex or flex circuit. As the name implies, surface mount is […]

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