Working together, PCB designers and fabricators can explore manufacturing techniques that optimize designs, reduce routing layers and minimize PCB costs. Fine-pitch BGAs are making PCB designers think twice about implementing traditional fan-out patterns. Now, the burden is on the designer to carefully study a board design and to devise certain fan-out strategies that don’t adversely […]Continue Reading...
MicroBGAs provide electrical and physical advantages at the cost of increased design and manufacturing complexity. The micro-ball grid array is one of the most advanced surface mount devices and is quickly becoming the package of choice for the electronic circuit designer. A microBGA is a subclass of the generic ball grid array (BGA). Typical BGA […]Continue Reading...
Designs with analog, digital and RF features challenge the PCB designer to reduce noise, improve EMI performance and lower distortion. The layout of an efficient mixed-signal design can be both time consuming and challenging. However, diligently working on this type of layout can result in a system with less crosstalk, more noise immunity and better […]Continue Reading...
Advanced AOI techniques provide manufacturers and OEM customers with exceptional inspection reliability. Automated optical inspection (AOI) technology is making significant progress as PCB designs continue to pack in more circuitry per square inch and create new inspection challenges. Nowhere is this felt more than in assembly. Both designers and EMS providers need to stay abreast […]Continue Reading...
The PCB designer is the architect for improved PCB yields. A major requirement in improving board fabrication yields is doing it right the first time, because once the PCB fabrication process is complete there is really no way to go back to fix major mistakes. In some cases you can mitigate design issues during the […]Continue Reading...
Understanding the critical process steps in design, fabrication and assembly can increase the robustness of the PTH and improve reliability. PCB real estate, along with components, vias, and annular ring sizes are shrinking dramatically. Five or 10 years ago, a via hole of 15 to 20 mils with a 5 to 10 mil annular ring […]Continue Reading...
When using differential circuits, specific design rules can maximize the advantages while minimizing design-induced difficulties. As the PCB industry moves toward designing faster and more miniaturized products, data rates are constantly increasing, and printed circuits are shrinking. The need for transmitting the signals cleanly from the driver to the receiver has become of prime importance […]Continue Reading...
Filled via-in-pad processes are a way to achieve an intermediate density increase for a minimal additional cost. In PCB design, via refers to a plated hole that connects copper tracks from one layer of the board to other layers. High-density multilayer PCBs may have blind vias, which are visible only on one surface, or buried […]Continue Reading...
High pin count BGAs capture significant improvements in thermal and electrical performance. With the advent of programmable logic devices (PLDs), there has been a non-stop increase in device density and I/O pins. Moreover, OEMs are pushed toward using increasingly miniaturized components at reduced costs. These factors have made the BGA package increasingly popular. Yet, they […]Continue Reading...
Improving layout technique and focusing on physical layer structure can optimize signal integrity. With today’s high-speed chipsets transmitting data above 10+Gb/s, and rise times going below 30 ps, even small parasitic inductances and capacitances can degrade a signal and introduce noise. Occasionally, PCB layout is regarded as one of the last steps in the design […]Continue Reading...