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Make sure your ATE PCB is Ultra Clean

The main reason ATE PCBs must be properly and comprehensively cleaned is largely due to the DUT. DUT stands for device under test, which is the circuit area on the ATE PCB where your new µP, SoC, FPGA, or any other valuable semiconductor product is to be tested. Special care must go toward eliminating any […]

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Locking in security at the IoT PCB level

The electronics manufacturing services provider designing and assembling IoT printed circuit boards must have a comprehensive understanding of today’s electronics that contribute to an IoT device’s security. Certainly, a great number of software vendors are supporting the IoT products businesses with their versions of security software. However, from a hardware point of view, chipmakers are […]

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Anatomy of ATE PCB Assembly

An automatic test equipment (ATE) PCB (a.k.a. a test board) is at the heart of all major test activities targeted at verifying a specific semiconductor chip’s functionality. Semiconductor chip technology has become so advanced that testing these highly complex devices must be performed effectively to ensure high reliability and functionality. This allows chipmakers to convey […]

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Ultra-clean IoT PCBs assure high reliability

IoT devices going into military/aerospace, medical and/or highly specialized industrial applications demand ultra-high reliability so they operate properly according to their tight specifications. That means the small IoT printed circuit boards (PCBs) must be ultra-clean and virtually free of any contaminants or chemical residues. But to understand how best to gain that IoT reliability, we […]

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Update on PCB Stencil Design and Printing

Stencil design and printing is one of the most important steps when it comes to PCB assembly. Knowing how to properly design the stencil and implement paste dispensing for assembly takes considerable knowhow and in-depth experience. In this instance, there’s no substitute for experience since textbooks on the subject are few and far between. Take […]

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Proper Decoupling Capacitor Placement For Signal Integrity

Signal integrity demands considerable attention due to the increasing complexity of PCB designs and the highly advanced digital and analog components OEM system houses require. There are countless areas a PCB layout engineer can overlook, thus creating signal integrity issues One especially important aspect is proper decoupling capacitors for BGA consideration. It is recommended that […]

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Get a Grip on Wearable/IoT PCB Terminology

Wearable/IoT PCB technology is ushering in new design terminology and steps that need to be factored in. Two particular areas that need to be understood deals with (1) low and high modulus boards and (2) flex circuit bending. Board modulus refers to its structure; low modulus means a softer structure, while high modulus refers to […]

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