Effectively transmitting electronic signals in an IoT product relies heavily on how device packaging, traces, routing and vias are designed in IoT rigid-flex or flex circuitry. Component or device packaging includes micro ball grid arrays (micro BGAs), quad-flat no-leads (QFN) and dual-flat no-leads (DFN). These electronic device packages are less than the size of a […]Continue Reading...
The electronics manufacturing services provider designing and assembling IoT printed circuit boards must have a comprehensive understanding of today’s electronics that contribute to an IoT device’s security. Certainly, a great number of software vendors are supporting the IoT products businesses with their versions of security software. However, from a hardware point of view, chipmakers are […]Continue Reading...
The demand for and technology of IoT devices are rapidly passing the consumer market and landing squarely in medical electronics, IT/enterprise, industrial and military markets. And those IoT markets are experiencing dramatic growth. However, those markets are highly demanding when it comes to high reliability. IoT devices in these instances must be reliable to the […]Continue Reading...
IoT devices going into military/aerospace, medical and/or highly specialized industrial applications demand ultra-high reliability so they operate properly according to their tight specifications. That means the small IoT printed circuit boards (PCBs) must be ultra-clean and virtually free of any contaminants or chemical residues. But to understand how best to gain that IoT reliability, we […]Continue Reading...