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Fill Up Through Holes in IoT Rigid-Flex and Flex Circuits

Requirements for Class III IoT devices are very specific. IoT applications falling into this category include mil/aero and medical electronics. In the assembly process for any type of PCB, either surface mount technology or through hole is used to place components onto an IoT rigid-flex or flex circuit. As the name implies, surface mount is […]

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Flex Circuits Offer The Best Of All Worlds

The growing NexLogic customer demand for the design and manufacturing of wearables and Internet of Things (IoT) is dramatically expanding our flex circuitry design and manufacturing experience base. Not long ago, flex circuitry was considered a required item for a particular PCB design. However, today, it is taking center stage and is mainstream, not only […]

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