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Embedded: Making efficient use of BGA signal routing in PCB designs

Ball grid array (BGA) device packaging is today’s standard for housing a range of highly advanced and complex semiconductor devices like FPGAs and microprocessors. The technology of BGA packaging for embedded designs is steadily advancing to keep up with chipmaker technical advances, with this type of packaging splintering out into standard and micro BGAs. Today, […]

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Embedded: Avoiding embedded PCB design defects

A number of different solder defects and associated failures in embedded designs are becoming more prevalent due to smaller printed circuit boards (PCBs) as well as shrinking ball size and pitch of ball-grid array (BGA), chip-scale (CSP), and quad-flat no-lead (QFN) packaging… Read More

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Embedded: Bringing experimental development methods to PCB design and manufacturing

PCB technologies are undergoing a major new evolution unlike anything the industry has seen before. Issues relating to PCB size, shape, complexity, thermal requirements, and shrinking board space are creating design and assembly/manufacturing challenges for the original equipment manufacturers (OEMs), chip and component makers, material suppliers, and the electronic manufacturing services (EMS) providers. The effort […]

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Embedded: Overlooking design-for-test can lead to costly PCB design rework

In the design phase of many printed circuit boards, the engineer is more interested in functional testing, making sure that the system he has developed meets the original specifications. Little thought may be given to incorporating features that allow visibility into the board to make sure it meets specs of the in-house manufacturing associates or […]

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Embedded: Applying Design for Manufacturing (DFM) to PCB development

In design for manufacturing (DFM), PCB design layout engineers can easily overlook key factors that at first glance don’t appear significant. But later on, these factors play a major role during manufacturing and can turn out to be the root cause of poor yields. When it comes to high-speed PCB designs, above 20 GHz in […]

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Embedded: Migrating your embedded PCB design from DDR2/3 to DDR4 SDRAMs

PCB and embedded systems designers are scratching their heads these days, facing some uncertainty as they start mapping out the move from DDR3 SDRAM to DDR4. Routing DDR2 signals on a PCB was tough enough. But with DDR3 it proved to be even more difficult and challenging. The big question now is: will DDR4 be […]

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Embedded: Seven ways to avoid embedded PCB engineering change orders

Engineering change orders (ECOs) drive up design costs and result in numerous delays in product development that in turn result in costly extension of time to market. However, most ECOs can be avoided by paying careful attention to seven critical areas where problems frequently occur: component selection, memory, moisture sensitivity levels (MSL), design for test […]

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Embedded: Saving your embedded printed circuit board design with forensic technology

Continually shrinking printed circuit boards (PCBs) populated with greater numbers of package-on-package (PoP) devices have made it tougher for design engineers to locate causes of system failures. After spending many hours or days trying to uncover design defects and flaws using traditional methods such as automated optical inspection (AOI) or x-ray, design engineers may simply […]

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Critical guidelines for RF and microwave PCB Design

A few decades ago, there wasn’t much demand for RF and microwave circuits. They were difficult to design into the architectures of the time, and so costly that only mil/aero projects could afford them. But today RF circuitry is crammed into a large variety of commercial products. Most of these are handheld wireless devices for […]

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Building quality & signal integrity into PoP-based PCB design & assembly

New ways of working with sub-assembly printed circuit board (PCB) design and assembly have become necessary to design effectively for the new era of package-on-package (PoP) technology. Following the new design guidelines and assembly procedures for high density ICs fabricated with nanometer-scale geometries will assure that an OEM’s product will meet its performance objectives. Read […]

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