Package-on-package (PoP) technology is coming on strong and continues to overshadow the ever popular system-on-chip (SoC) and other similar packaging types. The rationale behind PoP is simple. More OEMs are miniaturizing their products, but are intent on adding more functionality. Hence, the only way to go to meet these challenges is to make the printed […]Continue Reading...
The industry’s conversion from leaded (eutectic) to lead-free has been slow. The industry perception prior to July 2006 was a virtual overnight switch to lead-free. However, today many OEMs still have a “don’t care, wait and see attitude” since they’re either RoHS-exempt at this time or don’t sell into Europe. Others are at the decision-making […]Continue Reading...