Creating a thermal profile isn’t as straightforward as it once was. PCBs are populated with a growing assortment of new packaging and technologies, introducing new challenges and their associated tradeoffs when it comes to creating the thermal profile. Usually, a conventional board consists of a mix of passive and active components in traditional packaging. Increasingly, […]Continue Reading...
Capital spending is an internal issue EMS providers constantly grapple with. At the back of the minds of the decision-makers are a host of related and nagging questions. Can we make do with existing equipment? What are our tradeoffs? Will we lose money using older assembly equipment? How will customers perceive older equipment? Can we […]Continue Reading...
Perfect thermocouple placement is necessary for optimized profiles. Growing numbers of printed circuit boards are now denser and smaller to comply with wireless and portable applications, bringing a new round of challenges to create the proper thermal profiles. Even the smallest boards come in a vast number of sizes, shapes and thicknesses, and each requires […]Continue Reading...
As packages get smaller, the risk for damage to moisture-sensitive devices increases. With the higher temperatures required for Pb-free soldering, that risk is further compounded. That’s why it’s extremely important to be aware and vigilant of MSDs. ICs can act like a sponge. If they have semi-permeable membranes, moisture from the ambient air can get […]Continue Reading...
Component assembly is ripe for defects. Here’s how to avoid them. Placement must undergo various checks to ensure components are the correct ones and to locate potential problems. The first check is at the SMT stage. Called a feeder component check, it involves identifying each part on the reels or trays and matching them with […]Continue Reading...
Taking a middle ground is verboten to avoid assembly problems. Stencil design calls for three main criteria. One, the stencil should be completely flat because it needs to evenly distribute the amount of paste on all sides of the board. Two, it should be able to control solder paste spillage. If solder paste is spilled […]Continue Reading...
Positioning CSPs and noise-sensitive devices are two of a host of considerations. Effective, accurate component placement takes into account the best practices of design and assembly, both of them inextricably intertwined. The layout engineer must take special care to correctly place components on the board, since this has a direct bearing on assembly and testability. […]Continue Reading...
Migrating from manual to automated assembly and test. Semiconductor companies pour millions of dollars into developing state-of-the-art chips like multi-core microprocessors, DSPs, FPGAs, ASICs, DRAMs and flash, among others. Semiconductor testing always has proven challenging. But as chips get more complex and smaller, the difficulties become even more apparent, both in cost and time. Successfully […]Continue Reading...
Why operators skip important features – and what to do about it. Automated vision inspection is among the top features of most advanced stencil printers. Other top features and process-related techniques include underside cleaning with vacuum automatic placement of support pins and auto paste dispensing. In some PCB assembly camps, vision inspection and other major […]Continue Reading...
Complex, BGA-laden PCBs demand one-of-a-kind profiles. PCBs laden with BGAs, some on both the component and solder sides of the board, are a challenge to thermally profile. And not only are PCBs increasingly populated with challenging BGA packages, but they are becoming more dense and smaller to comply with portable and wireless applications. Add to […]Continue Reading...