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AirVac Onyx 29

Features

Air Vac ONYX29 with 9 micron placement accuracy for rework and production applications.
This system handles a wide variety of device packaging – BGAs, microBGAs, CSPs, leaded devices & SMT connectors.
It provides an unparalleled level of automation and process control for SMT rework and assembly.
The tool changer automatically selects and changes nozzles based on program instructions.
The Pick and Prep station provides automatic component pick up and preparation including flux dipping, paste on device and solder paste dipping.
The Process Development Wizard automatically creates a complete rework process based on structured prompts.
It has fully automated non-contact site cleaning, force-controlled auto placement and motorized vision with zoom feature.
Air Vac Onyx29 provides an ultra-fast heat up for lead-free rework.
It provides large, clear images for component alignment, uniform joint temperature, and process repeatability.