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AirVac DRS25

Features

AirVac DRS 25 provides the highest quality and most efficient SMT rework on BGAs, CSPs, flip chip, fine pitch QFPs, plastic sockets, PLCCs, BGA sockets, BGA & SMT connectors.
It provides the capability to preheat high thermal mass boards for higher preheat temperatures that lead-free rework requires.
The IR pre-heater insulated heating elements throughout the entire preheat surface provide ultra-fast heat up with excellent thermal uniformity.
AirVac DRS25 system has software that provides thermal profiling of both lead-free and tin lead devices.
Colored LEDs in the DRS25 simplify the alignment process by color differentiation of component leads/spheres and pads to help with this easy alignment.
DRS25 system has advanced custom nozzle technology with an array of hot gas, hot bar and heat through nozzles designed to handle any application.
Hot bar nozzle technology provides ramp-controlled conductive heating to prevent thermal shock and prevents adjacent 0201 devices as close as .010" away from reflowing.
DRS25 has powerful process heating, flexible software, precision automation, and proprietary site pad cleaning.