In our industry, we often hear that in many cases design-for-test or DFT is implemented right before a PCB design arrives at the assembly stage. Lots of times this happens, intentionally or inadvertently, when an OEM uses separate PCB design and assembly houses to save a few dollars or for other reasons.
Thus, DFT becomes an unwise and costly afterthought for the OEM. As a result, obvious and/or latent defects can be overlooked during assembly, creating significant and costly problems for an OEM’s product.
That’s why it is prudent for an OEM to work in tandem with its contract manufacturer (CM) or EMS provider at the outset to craft a printed circuit board test strategy ideally suited in application and cost to its particular product lines.
There is no single inspection or PCB testing system that will meet the needs of every manufacturing environment. Therefore, a number of factors must be considered in developing any given strategy. From a dollars and cents and reliability perspective, it’s important to target the proper test procedure for a particular product.
If a product is sufficiently mature, for example, the printed circuit board should be fully functional and only minimal debug and test may be required. Testing complex PCBs, on the other hand, whether for a new or mature product, incurs considerably more detail, especially if PCBs use surface mount technology (SMT).
In this regard, DFT or tailoring the PCB test coverage to specific product modules is essential in a test strategy. This particular aspect assures sufficient test point coverage in a printed circuit board’s digital and analog modules, for example, because each requires different testing.
A test strategy’s foundation is to first get a good understanding of the types of printed circuit board testing available and where they are most appropriate from a product and cost point of view. The three main test types are in-circuit test (ICT), flying probe, and functional test.