Assembly

From prototype through production and quick-turns through standard and scheduled deliveries, let our highly competent in-house PCB assembly operation handle all of your assembly needs.

Although we feature high speed pick and place machines, multi-zone reflow ovens and Electrovert dual wave / chip wave solder machines, the heart and soul of our assembly operation is the people on the assembly floor. Your assemblies are in the hands of the most motivated and talented group of Program Managers, Process Engineers, Floor Leads, QC Personnel, Kit Auditors, Prototype Technicians and Touch-up Technicians that can be found.

You won’t find a team of people who take more pride in their work than the PCB Assembly team right here at NexLogic. This is evidenced by the growing number of “Thank You” letters we receive from customers, many of which have found a place on our conference room walls.

Pb-Free

We’re a leading supplier of lead-free assemblies for large to medium size OEMs. We work closely and successfully with our OEM customers in the semiconductor, medical, and mil/aero markets

In line with its growth strategy to serve different market segments and offer cutting-edge PCB solutions, NexLogic has established itself as a leader in Pb-free assembly (lead free assembly) capabilities. The Pb-free assembly lines are staffed with trained personnel to work with OEMs to handle all aspects of lead-free assemblies.

It’s the goal of NexLogic to become the leading supplier of lead-free assemblies for large to medium size OEMs. We’ll accomplish this goal by working closely and developing partnerships with these OEMs. NexLogic clients in the semiconductor, medical, and military/aerospace markets will benefit from the lead free assembly line as they transition to lead-free RoHS compliance solutions.

ISO Certification

NexLogic’s ISO 9001:2008 certification allows the company to further improve its internal processes and the quality of its PCB deliverables. The ISO certification and the quality management system in place, ensure that all of NexLogic’s procedures and processes are well maintained and documented.

Aside from ISO 9001:2008, NexLogic is also ISO 13485 certified and qualified for medical devices manufacturing. We’ve achieved our success with ISO 13485 certification through rigorous process improvement manufacturing excellence, as well as internal procedures and methodologies. Plus, we’ve made this process highly transparent and clear cut to avoid ambiguities.

An extremely well defined, highly reliable, and 100% dependable and repeatable process is the most important aspect of this 13485 certification. It plays a critical role when it comes to precisely monitoring and analyzing different human vital signs when individuals undergo healthcare procedures.

DOEs

PCB design and assembly has become the proving grounds for newer design of experiments or DOEs. But for them to be successful, they must be in the hands of experienced and innovative EMS Providers. We’ve got the depth and breadth in experience and technology to successfully collaborate with our customers to achieve successful DOEs. Read our EE Times article to get the full explanation of our DOEs.

Special PCB Cleaning

PCB assembly uses flux and solder paste to mount SMT packages and devices on to the surface of a board. After assembling them on the PCB, those agents leave residues that need to be cleaned to maintain high reliability. Here are some key points to keep in mind:

  • Most PCB assemblies are cleaned with de-ionized (DI) water at a hot temperature ranging from 100 to 120°F (Fig. 1) and mostly containing three to five percent chemistry and the remaining is water.
  • Bottom-terminated packages like QFN, CSP, and flip chip demand the use of no-clean flux and paste for better cleaning results. But DI water isn’t used since it leaves white residues. Rather, a batch cleaning process including certain chemistries is used. If the application needs even greater cleaning like 99.99%, then a de-greaser is used to eliminate tiny remnants caught underneath components.
  • High-speed PCB applications generally rely on de-greasing. However, it requires quantitative measurement performed by Ionographic cleaning to measure cleanliness as an objective measurement.

Assembly-Related Defects

There are a number of defects that can result from poor PCB assembly practices. Here is an image collection of some of the most prominent. It’s important for you and your team to carefully evaluate an EMS Provider’s demonstrated track record to avoid these kinds of costly defects.

Figure 1 - Shorted BGA balls

Figure 1 – Shorted BGA balls

Figure 2 - BGA open

Figure 2 – BGA open

Figure 3 - Bridging

Figure 3 – Bridging

Figure 4 - Tombstoning

Figure 4 – Tombstoning

Figure 5 - Hairline Crack on BGA Ball

Figure 5 – Hairline Crack on BGA Ball

Figure 6 - Un-collapsed BGA ball due to cold thermal profile

Figure 6 – Un-collapsed BGA ball due to cold thermal profile

Figure 8 - X-ray of Voids

Figure 8 – X-ray of Voids

Figure 9 - BGA balls separated from substrate

Figure 9 – BGA balls separated from substrate

Figure 10 - Fingerprints on PCB

Figure 10 – Fingerprints on PCB

Figure 11 - Residues left after using no-clean flux without batch cleaning

Figure 11 – Residues left after using no-clean flux without batch cleaning