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Pb-Free Central
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RoHS Compliance/Pb-Free Central
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| » Legislative Requirements |
| » Market Driven Requirements |
| » Requirements determined by definition of Pb-Free Electronic Products |
| » Products impacted |
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Design & Layout
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| » Physical footprint |
| » SMT considerations |
| » Components on both sides |
| » Impedance Control |
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Fabrication
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| » Pb-Free board finishes, OSP, immersion Tin, Silver Immersions, Gold/Nickel, etc. |
| » Thermal compatibility with Pb-Free process, Tg changes possible |
| » Halogen-Free laminate |
| » Halogen-Free solder mask |
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Material Management
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| » Labels: Eutectic vs. Pb-Free Components |
| » Labeling, Inspection, Storage and Dispensing |
| » Education |
| » Pb-Free finishes |
| » Thermal compatibility with the assembly process |
| » Plastic molding compounds thermal compatibility |
| » Halogen-free plastics |
| » Moisture Sensitivity level changes |
| » Shelf life and logistical control |
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Assembly
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| » Solder Pastes |
| » Rework/Reflow |
| » Internal Package structure |
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Creating RoHS Compliancy/Pb-Free Roadmap
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| » One-stop shop |
| » Capable Design Team knowing the difference between Eutectic vs. Pb-Free design techniques |
| » Complete & dedicated Pb-Free line for Assembly |
| » Fabrication department well versed in fabrication issues, material temperatures & specifications and surface finishes |
| » Assembly process is defined in details and implemented properly on every assembly job |
| Buyers who are material managers and components engineers who are properly trained in Pb-Free components. |
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