RoHS Compliance/Pb-Free Central
	» Legislative Requirements
	» Market Driven Requirements
	» Requirements determined by definition of Pb-Free Electronic Products
	» Products impacted

 

	Design & Layout
	» Physical footprint
	» SMT considerations
	» Components on both sides
	» Impedance Control

 

	Fabrication
	» Pb-Free board finishes, OSP, immersion Tin, Silver Immersions, Gold/Nickel, etc.
	» Thermal compatibility with Pb-Free process, Tg changes possible
	» Halogen-Free laminate
	» Halogen-Free solder mask

 

	Material Management
	» Labels: Eutectic vs. Pb-Free Components
	» Labeling, Inspection, Storage and Dispensing
	» Education
	» Pb-Free finishes
	» Thermal compatibility with the assembly process
	» Plastic molding compounds thermal compatibility
	» Halogen-free plastics
	» Moisture Sensitivity level changes
	» Shelf life and logistical control

 

	Assembly
	» Solder Pastes
	» Rework/Reflow
	» Internal Package structure

 

	Creating RoHS Compliancy/Pb-Free Roadmap
	» One-stop shop
	» Capable Design Team knowing the difference between Eutectic vs. Pb-Free design techniques
	» Complete & dedicated Pb-Free line for Assembly
	» Fabrication department well versed in fabrication issues, material temperatures & specifications and surface finishes
	» Assembly process is defined in details and implemented properly on every assembly job
	Buyers who are material managers and components engineers who are properly trained in Pb-Free components.