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Industry News/Speaking Engagements

 

PCB West 2012

Santa Clara, California
Wednesday, September 26, 1 30 pm - 2 30 pm

Topic:

Package on Package (PoP) Technology

Speakers:

Zulki Khan: Founder/President, NexLogic Technologies, Inc.

Avoid Costly Redesign with Altium Designer WEBINAR

May 4, 2012
Address: Hilton Garden Inn San Jose/Milpitas 30 Ranch Drive, Milpitas, CA 95035

Topic:

Imagine a system development platform that enables you to avoid costly redesigns and supports hierarchical projects consisting of PCB, FPGA and embedded software. Component management, ECO management, design reuse, manufacturing release management, 3D PCB, and more in one product for one price.

LED PCBs Webinar

Friday, October 21 · 10:00am pst / 1:00pm est

Topic:

Like they say, you ain't heard nothing yet. That's very appropriate for LEDs and the increasing numbers of new uses and applications for these tiny, yet powerful and low-cost lighting sources. Last year, the hot news was LEDs replacing old traditional headlights in automobiles. This year, white LEDs are making great inroads into the growing numbers of smartphones and tablet PCs as low-cost backlights for LCD displays.

PCB West 2011

Santa Clara, California
Tuesday, September 27, 8 30 am - 9 30 am

Topic:

LED Design, Fabrication and Assembly

Speakers:

Zulki Khan: Founder/President, NexLogic Technologies

Open House April 2010

NexLogic Technologies invites you to our Open House on April 30, 2010, 11:00 am to 4:00 pm to celebrate our 15th year in business anniversary and the move to our new and expanded facility.

NexLogic Technologies, Inc.

2085 Zanker Road
San Jose, CA 95131

PCB West 2009

Santa Clara, California
Wednesday, September 16, 9 am - 11 am

Topic:

Micro BGA Design, Fab and Assembly

Speakers:

Zulki Khan: Founder/President, NexLogic Technologies
Syed Wasif: Design Engineer, NexLogic Technologies

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In The News

November 8, 2007

NexLogic founder & president, Zulki Khan, speaks at Surface Mount Technology Association

Title: “Operating a Contract Assembly Company in Silicon Valley”

Challenges, Operating & Successful Contract Assembly

More info...


Events

Zulki Khan presenting at PCB West

 



When: Monday, March 27, 2006, 9 AM - 11 AM
Where: Santa Clara Convention Center, Santa Clara, CA
What: PCB West Conference Course 011 – Mixed-Signal Board Design

Speakers: Imran Khan, Syed Rizvi and Wasif Ali of NexLogic
Attendees: PCB designers and anyone with a basic knowledge of PCB design.

Designing mixed-signal boards calls for certain considerations that are critical for achieving optimum performance. Analog and digital devices have different characteristics, including power ratings, current, voltage callouts, and heat dissipation requirements. Attendees will learn the steps to effectively design mixed-signal components on a PCB, as well as the various adverse results of not properly designing these two different technologies on a PCB.
More info...


When: Monday, March 27, 2006 3 PM – 4 PM
Where: Santa Clara Convention Center, Santa Clara, CA
What: PCB West Conference Course 024 - The Impact of Lead-Free on Fabrication

Speaker: Zulki Khan, NexLogic
Attendees: PCB fabricators, PCB designers and anyone interested in manufacturing PCBs in the era of RoHS and WEEE.

Get the lead out! The movement to lead-free assembly is having a distinct impact on PCB fabrication. Removing lead from the picture often causes an increase in contact time, bump speed, and peak temperature. In this one-hour workshop, attendees will learn how board thickness and surface finish affect lead-free fabrication. Attendees will learn about lead-free-compliant surface finishes (ENIG, immersion silver, OSP, etc.), why they are important to lead-free PCB fabrication, and discuss the various tradeoffs and key advantages associated with each finish.
More info...


When: Thursday, March 30, 2006, 11 AM – 12 PM
Where: Santa Clara Convention Center, Santa Clara, CA
What: PCB West Conference Course 074 - DFM, Test and Assembly Strategies

Speaker: Zulki Khan, NexLogic
Attendees: PCB designers, test engineers, layout engineers and assembly personnel.

Product and technology evolution continues to play a significant and ever changing role in PCB design for manufacture (DFM), test, and assembly. DFM, test and assembly strategies must focus on the OEM’s specific product needs and the required techniques and methodologies used. Attendees will learn details of each aspect of DFM, test, and assembly, as well as methods for deploying correct strategies at specific levels of products: consumer, industrial, medical and mil/aerospace. Examples of ineffective DFM, test, and assembly techniques will also be discussed.
More info...


 
     
 
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