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Design Practices for Panelization and Depanelization
Tuesday, June 03, 2014
Design Practices for Panelization and Depanelization in PCD&F
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Overlooking design-for-test can lead to costly PCB design rework
Monday, June 02, 2014
Overlooking design-for-test can lead to costly PCB design rework in embedded
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Zulki's PCB Nuggets: Tighter Scrutiny Needed for PCB Cleaning Agents
Tuesday, May 13, 2014
Zulki's PCB Nuggets: Tighter Scrutiny Needed for PCB Cleaning Agents in SMT Magazine
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Applying Design for Manufacturing (DFM) to PCB development
Monday, March 17, 2014
Applying Design for Manufacturing (DFM) to PCB development in Embedded
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Zulki's PCB Nuggets: Uncovering Assembly Problems of High-Speed PCBs
Wednesday, March 12, 2014
Uncovering Assembly Problems of High-Speed PCBs in SMT Magazine
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The Basics of Thermal Profiling for Sensitive Components
Thursday, January 30, 2014
The Basics of Thermal Profiling for Sensitive Components in Circuits Assembly
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Migrating your embedded PCB design from DDR2/3 to DDR4 SDRAMs
Monday, January 20, 2014
Migrating your embedded PCB design from DDR2/3 to DDR4 SDRAMs in Embedded
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Zulki's PCB Nuggets: EMS Discovers Mature IC Technologies
Tuesday, January 14, 2014
ECOs Reviewed - The Importance of Accuracy in SMT Magazine
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Yardsticks for Gauging AOI Effectiveness
Thursday, December 19, 2013
Yardsticks for Gauging AOI Effectiveness in Circuits Assembly
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PoP-based PCBs move to center stage
Tuesday, November 26, 2013
PoP-based PCBs move to center stage in ECN Magazine
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Zulki's PCB Nuggets: Another Look at AOI
Wednesday, November 13, 2013
Zulki's PCB Nuggets: Another Look at AOI in SMT Online
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Zulki's PCB Nuggets: ECOs Reviewed - The Importance of Accuracy
Monday, September 23, 2013
ECOs Reviewed - The Importance of Accuracy in SMT Magazine
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Seven ways to avoid embedded PCB engineering change orders
Monday, August 05, 2013
Using Forensics to Improve PCB Design and Assembly in Embedded
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Using Forensics to Improve PCB Design and Assembly
Tuesday, June 18, 2013
Using Forensics to Improve PCB Design and Assembly in PCD&F
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Saving your embedded printed circuit board design with forensic technology
Wednesday, May 29, 2013
Saving your embedded printed circuit board design with forensic technology in Embedded
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Critical guidelines for RF and microwave PCB Design
Wednesday, April 10, 2013
Building quality & signal integrity into PoP-based PCB design & assembly in Embedded
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Zulki's PCB Nuggets: FAI - An Ounce of Prevention, Worth a Pound of Cure
Tuesday, April 09, 2013
Zulki's PCB Nuggets: FAI - An Ounce of Prevention, Worth a Pound of Cure in SMT Magazine Online
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Zulki's PCB Nuggets: The Intricacies of RF Design & Assembly
Monday, March 25, 2013
Zulki's PCB Nuggets: The Intricacies of RF Design & Assembly in SMT Magazine Online
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Building quality & signal integrity into PoP-based PCB design & assembly
Monday, February 11, 2013
Building quality & signal integrity into PoP-based PCB design & assembly in Embedded
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Zulki's PCB Nuggets: Critical Aspects of a Thermal Profile
Monday, February 11, 2013
Zulki's PCB Nuggets: Critical Aspects of a Thermal Profile in SMT Magazine Online
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Quality Management: Key To Medical Electronics Assembly and Manufacturing
Thursday, January 17, 2013
PCD&F in 'Medical Design Briefs
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Stepping Out With 0.4mm Pitch BGA/PoPs
Tuesday, November 06, 2012
PCD&F in 'PCD&F' Magazine
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Zulki's PCB Nuggets: Get a New View on X-Ray
Tuesday, October 16, 2012
Zulki's PCB Nuggets: Get a New View on X-Ray in SMT Magazine Online
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Ultra-fine pitch devices pose new PCB design issues
Friday, October 05, 2012
Ultra-fine pitch devices pose new PCB design issues in Embedded
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MEMS/SMT Hybrid PCBs Take Design/Assembly Detour
Thursday, August 09, 2012
MEMS/SMT Hybrid PCBs Take Design/Assembly Detour in SMT Magazine Online
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Thermal Profiling Small PCBs
Friday, June 29, 2012
Some BGA balls will have more solder than others. in Circuits Assembly
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A Commitment to Greater U.S. Manufacturing
Thursday, June 21, 2012
A Commitment to Greater U.S. Manufacturing in SMT Magazine Online
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Turning the Page on Coplanarity
Tuesday, April 24, 2012
Some BGA balls will have more solder than others. in SMT Magazine
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Underfill revisited: How a decades-old technique enables smaller, more durable PCBs
Monday, January 30, 2012
Typical underfill process for a micro-BGA in EETimes
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Zulki Khan Reviews 2011
Monday, January 23, 2012
Tiny micro-CSP on a dime compared to conventional device package. in SMT Magazine
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Evaluating PCB layout tools: A board developer’s perspective
Friday, December 02, 2011
EE Times in EETimes
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Smoothing the Layout to Test Flow
Monday, October 31, 2011
PCD&F in 'PCD&F' Magazine
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Assuring PCB reliability by building in additional tolerances
Wednesday, October 12, 2011
EE Times in EETimes
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Taking on the 0.3 mm Ultra-Fine Pitch Device Challenge in PCB Design
Wednesday, October 05, 2011
EE Times in EETimes
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FOD Can Cause High-Reliability FUD
Wednesday, September 21, 2011
Circuit Assembly in SMT Magazine
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Advanced Packages Change PCB Landscape
Monday, June 27, 2011
Circuit Assembly in SMT Magazine
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A "Must-List" for Aviation PCBs
Tuesday, June 14, 2011
Circuit Assembly in SMT Magazine
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Considerations for Proper Layout of a High-Speed PCB
Thursday, March 31, 2011
PCD&F in 'PCD&F' Magazine
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Procurement ‘Trio’ Poses OEM Issues
Wednesday, March 02, 2011
PCD&F in 'PCD&F' Magazine
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Printing Difficult Applications
Tuesday, January 25, 2011
Circuit Assembly in SMT Magazine
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LED PCBs for the Auto Industry
Thursday, January 06, 2011
CircuiTree in CircuiTree Magazine
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Ever-Changing Reflow Landscape
Wednesday, November 17, 2010
Circuit Assembly in SMT Magazine
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MSD Protection Steps Per J-STD-033B.1
Wednesday, November 17, 2010
Circuit Assembly in Circuit Assembly Magazine
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Ensuring Accurate Placement
Thursday, October 28, 2010
Circuit Assembly in Circuit Assembly Magazine
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Thermal Management and Power Integrity in Tight Spaces
Wednesday, October 06, 2010
CircuiTree in RTC Magazine
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Getting a Handle on Effective Design for Assembly
Tuesday, July 06, 2010
CircuiTree in CircuiTree Magazine
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Designing In Thermal Management
Monday, June 28, 2010
SMT in SMT Magazine
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PCB Prototype Manufacturing
Friday, May 21, 2010
PCD&F in CircuiTree
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Why Mixed Signal Calls for Precise Stencils
Monday, April 12, 2010
PCD&F in Circuits Assembly Magazine
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PCBs in the Medical Field
Monday, March 15, 2010
PCD&F in CircuiTree
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Component Layout in Placement Processes
Thursday, February 11, 2010
PCD&F in Circuits Assembly Magazine
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New Materials and Techniques Tackle PCB Thermal Management
Monday, January 25, 2010
PCD&F in RTC Magazine
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Improving Fabrication Yields
Friday, January 08, 2010
PCD&F in 'PCD&F' Magazine
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Processes for Building Test Boards
Tuesday, December 15, 2009
CAM in Circuits Assembly Magazine
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Overlooked Features of Stencil Printers
Wednesday, December 02, 2009
CAM in Circuits Assembly Magazine
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Anatomy of a Correct Thermal Profile
Tuesday, November 17, 2009
CAM in Circuits Assembly Magazine
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Challenges in PCB Layout, Fab, and Assembly for Mobile Technology
Monday, November 09, 2009
PCD&F in CircuiTree
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PCBs in Aerospace: Going Above and Beyond SOP
Friday, September 18, 2009
PCD&F in CircuiTree
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Tapping Into PCBs for PV Thermal Issues
Thursday, July 23, 2009
PCD&F in CircuiTree
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Managing Crosstalk and Ground Bounce
Thursday, July 02, 2009
PCD&F in 'PCD&F' Magazine
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Fan-Out Strategies for Fine-Pitch BGAs
Monday, June 08, 2009
SMT in PCD&F Magazine
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Quality Assurance: Planning is Valuable
Wednesday, May 13, 2009
SMT in SMT Magazine
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Designing with MicroBGAs
Monday, April 06, 2009
SMT in PCD&F Magazine
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Industry View: Medical Electronics OEMs: Prepare for Lead-free
Monday, February 23, 2009
SMT in SMT Magazine
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The Big Deal Over Fine Pitch Assembly
Monday, February 16, 2009
CAM in CircuiTree
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The Ins and Outs of BGA Reballing
Monday, February 09, 2009
SMT in SMT Magazine
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Ready For Lead-Free Medical Electronics?
Wednesday, December 10, 2008
EE Times in ECN Magazine
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Medical Devices Must Go Lead-free
Thursday, November 13, 2008
EE Times in EE Times Magazine
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Mixed Signal Design Considerations
Monday, October 13, 2008
PCD&F in 'PCD&F' Magazine
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CAM/CAD Design Rules and Guidelines
Thursday, October 09, 2008
CAM in CircuiTree
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‘Checking Up’ on Medical Electronics
Friday, October 03, 2008
CAM in Circuits Assembly Magazine
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Design, Fabrication, Assembly — What Changes for Harsh-environment Electronics?
Monday, September 29, 2008
SMT in SMT Magazine
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The Time is Now to Go Lead-Free
Monday, September 29, 2008
SMT in Medical Design
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Mastering Mixed Assembly Processing
Friday, August 22, 2008
SMT in SMT Magazine
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Auditing a Fabricator
Friday, August 01, 2008
CAM in Circuit Assembly Magazine
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AOI - Defining Reliability for Complex Designs
Sunday, June 01, 2008
PCD&F in 'PCD&F' Magazine
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Moving up to DDR2 at printed circuit board layout
Sunday, May 25, 2008
EE Times in EE Times Magazine
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Minding the Business of Contract Testing
Thursday, May 01, 2008
MPO in Medical Products Outsourcing
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Eliminating Board Defects
Thursday, May 01, 2008
CAM in Circuit Assembly Magazine
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Improving Fabrication Yields by Design
Tuesday, April 01, 2008
PCD&F in Printed Circuit Design & Fabrication (PCD&F)
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Ball Grid Array Soldering
Wednesday, February 06, 2008
AM in Assembly Magazine
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Designing to Improve PTH Reliability
Tuesday, January 08, 2008
PCD&F in Printed Circuit Design & Fabrication (PCD&F)
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Designing small, dense layouts for medical electronics products
Tuesday, January 01, 2008
ECD in Embedded Computing Design
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Weighing Dollars Vs. Test Strategies
Monday, December 10, 2007

The value an OEM places on testing electronic products is really high, considering the increasing costs associated with return material authorizations (RMAs), both in terms of lost productivity and corporate dollars.

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Benefits of Implementing Differential Pairs
Saturday, December 01, 2007
PCD&F in Printed Circuit Design & Fabrication (PCD&F)
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Elusive BGA Intermittent Connections
Sunday, November 11, 2007
SMT in SMT Magazine
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Creating Ideal Solder Joints
Thursday, November 01, 2007
CA in Circuits Assembly
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The Implementation of Via-in-Pad Interconnects to Increase PCB Circuit Density
Monday, October 01, 2007
PCD&M in Printed Circuit Design & Manufacture (PCD&M)
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A few guidelines for prototyping PCBs
Wednesday, August 01, 2007
MD in Medical Design Magazine
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BGA Escape/Routing Patterns for Fine-Pitch Devices
Wednesday, August 01, 2007
PCD&M in Printed Circuit Design & Manufacture (PCD&M)
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RoHS: One Year Later
Wednesday, August 01, 2007
SMT in SMT Magazine
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Tracking the Flow of Solder Defects
Saturday, June 30, 2007
SMT in SMT Magazine
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Taking Stock of Component Procurement
Sunday, June 03, 2007
CA in Circuits Assembly
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Strategies to Minimize Rework Challenges
Thursday, May 31, 2007
SMT in SMT Magazine
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PCB Design: Reducing emissions, increasing immunity and improving signal quality for complex, high-speed PCBs
Monday, April 30, 2007
PCD&M in Printed Circuit Design & Manufacture (PCD&M)
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10+ Gb/second Signal Considerations
Sunday, April 29, 2007
PCD&F in Printed Circuit Design & Fabrication (PCD&F)
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DFA is the best solution for grappling with varying machine tolerances
Saturday, March 31, 2007
CA in Circuits Assembly
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Selecting the Right SerDes Device
Wednesday, February 28, 2007
PCD&M in Printed Circuit Design & Manufacture (PCD&M)
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Curing Parts Headaches
Wednesday, February 28, 2007
AM in Assembly Magazine
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Designing robust circuit-board products for military and aerospace applications
Wednesday, January 31, 2007
M&AE in Military & Aerospace Electronics
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Surface Mount Technology (SMT) Step 1: Board Design
Monday, January 01, 2007
SMT in SMT Net
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Design for Medical Electronics Assembly
Monday, January 01, 2007
AM in Assembly Magazine
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Don't Assume Anything When It Comes To DFM
Tuesday, November 28, 2006
ED in Electronic Design
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BGA partitioning, PCB layout are crucial to video system design
Friday, November 17, 2006
in EE Times
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DFA Demands Upfront Attention
Saturday, September 02, 2006
in Printed Circuit Design & Manufacture (PCD&M)
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A Primer on AOI and AOT
Friday, September 01, 2006
in Circuits Assembly
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Lead-Free DFM Demands New Tricks
Tuesday, August 01, 2006
in Printed Circuit Design & Manufacture (PCD&M)
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Transitioning the OEM to Lead Free PCBs (Page 6)
Tuesday, August 01, 2006
in Lead-Free Connection, August 2006
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Nexlogic Technologies, Inc. ISO certified Company Introduces 'Mr. Lead-Free Lenny' Spokesperson At-large for Lead-Free Manufacturing
Tuesday, June 27, 2006
in Press Release Newswire
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Design-for-Test Considerations For PCB Design
Thursday, June 01, 2006
in SMT Net
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Getting Your Multilayer Board Fabricated
Thursday, March 30, 2006
in Printed Circuit Design & Manufacture (PCD&M)
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Key Design Techniques Reduce EMI/RFI Effects in Military Applications
Thursday, December 01, 2005
in Cots Journal
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Attaining Lead-free Solder Joint Reliability
Tuesday, November 01, 2005
in Surface Mount Technology Magazine
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No Lead Means Using Four Heating Zones and One Cooling Zone For Reflow
Saturday, October 01, 2005
No Lead Means Using.........
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Outsourcing 101
Saturday, October 01, 2005
in Printed Circuit Design & Manufacture (PCD&M)
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The Impact of Lead-Free on Design and Fabrication
Monday, August 01, 2005
in Printed Circuit Design & Manufacture (PCD&M)
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What you should know about Reliability Testing?
Wednesday, June 01, 2005
in Medical Design
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Nexlogic introduces new assembly line offering Pb-Free (lead-free) printed circuit solutions
Thursday, May 12, 2005
in Lead Free (pdf)
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Electronics Outsourcing: When the Connection Is Made
Friday, April 01, 2005
in Medical Device Link
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Medical Electronic Products Call for Higher Reliability
Tuesday, March 01, 2005
in ECN Magazine
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In the Mix: Tips of Mixed Signal Design
Tuesday, February 01, 2005
in Printed Circuit Design & Manufacture (PCD&M)
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High Reliability: Going Above and Beyond
Saturday, January 01, 2005
US Tech
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