Surface mount (SM) assembly is used for many PCB applications.

Hand soldering of components onto PCBs is occasionally used during PCB assembly.

In PCB design, via refers to a pad with a plated hole that connects copper tracks from one layer of the board to other layer(s).

A common industry practice is to deploy one of three types of thermal profiles, depending on PCB size and largely based on guesstimates.

BGAs are used more commonly now than ever before and are increasing design density and complexity.

Compliance of the European Union’s (EU) RoHS is now over a year old. There has been slow industry response partly due to the EU and associated agencies.

OEMs demand smaller and diverse packaging options to meet product design challenges and remain cost competitive in their respective markets.

The reflow soldering process for lead-free components is similar to conventional eutectic solder reflow process.

Rework is often regarded as a routine aspect of PCB production.

Welcome to the NexLogic Tip of the Month eNewsletter. This month’s edition features Design for Assembly (DFA).