PCB Assembly

NPI/Pilot Run/Prototype

  • BGA/Micro-BGA capabilities
  • Quick turn rework
  • BOM modifications OK
  • Drop-in parts replacement availability
  • Component swaps welcome
  • ECOs welcome
  • Passive components availability
  • Quick turn replacement for long-lead and obsolete parts
  • One time-line for full production build & testing
  • BOM scrubbing for cost reduction
  • RoHS/Non-RoHS BOM scrubbings
  • Micro Electronics
  • Wire bonding
  • Wedge bonding
  • Die Attach
  • FlipChip

Surface Mount/Paste Height

  • Laser-based AOI inspection
  • Full SMT pad coverage analysis
  • 5 SMT assembly lines
  • High speed placement
  • BGA/Micro-BGA capabilities
  • 01005 placement & x-ray
  • Double-sided SMT
  • Nitrogen reflow
  • PoP/Flip Chip towards/CSP capabilities
  • Micro Electronics
  • Wire bonding
  • Wedge bonding
  • Die Attach
  • FlipChip

Through Hole

  • Selective wave soldering
  • Press fit assembly
  • 5 SMT assembly lines
  • High speed placement
  • BGA/Micro-BGA capabilities
  • 01005 placement & x-ray
  • Double-sided SMT
  • Nitrogen reflow
  • Micro Electronics
  • Wire bonding
  • Wedge bonding
  • Die Attach
  • FlipChip

Thermal Profile

  • Custom profile for all new jobs
  • Real-time data collection
  • Full thermal modeling analysis
  • 5 SMT assembly lines
  • KIC on board
  • BGA/Micro-BGA capabilities
  • 01005 placement & x-ray
  • Double-sided SMT
  • Nitrogen reflow
  • Micro Electronics
  • Wire bonding
  • Wedge bonding
  • Die Attach
  • FlipChip

Box Build

  • Product assembly
  • Cable & harness assembly
  • Functional testing
  • 5 SMT assembly lines
  • Full product testing
  • BGA/Micro-BGA capabilities
  • 01005 placement & x-ray
  • Double-sided SMT
  • Nitrogen reflow
  • Micro Electronics
  • Wire bonding
  • Wedge bonding
  • Die Attach
  • FlipChip

Production

  • Full product testing
  • Box build
  • Scheduled shipments on demand
  • Overseas production solutions available
  • Free DFT analysis
  • Reliable and repeatable assembly
  • 5 SMT assembly lines
  • High speed placement
  • BGA/Micro-BGA capabilities
  • 01005 placement & x-ray
  • Micro Electronics
  • Wire bonding
  • Wedge bonding
  • Die Attach
  • FlipChip

For Bay Area Clients:

  • Same day local pick-up and delivery
  • After hours local pick-up and delivery
  • On-site local assembly and testing technician
  • “While you wait” rework services

What our clients say?

“Your courteous and knowledgeable staff, the flexible and fast high quality service and competitive pricing has made NexLogic my primary choice for all my PCB needs.”
Chris K., Apple Computers, Inc.

About NexLogic

Since 1995, NexLogic has established itself as a premier provider of PCB Design, PCB Fabrication, PCB Assembly, and Parts Procurement services. For over 20 years, our customers have relied on us to deliver their time sensitive jobs with the highest level of quality.

As a leading provider of PCB Design, PCB Fabrication and PCB Assembly services, NexLogic provides you with a unique, streamlined, one-stop solution for all of your printed circuit board needs.

We at NexLogic are committed to providing you with superior quality, personalized customer service, attention to detail and competitive pricing. We enter the market early so our customers have the opportunity to strike first and take over the market. By working with NexLogic, our customers achieve faster time-to-market by harnessing the power of one-stop design, fabrication, assembly, and material management

Pb-Free (Lead Free) Solutions

NexLogic is committed to providing Pb-Free (Lead Free) printed circuit board solutions. NexLogic recently added a new assembly line as part of its growth strategy with offering Pb-Free (lead-free) printed circuit solutions of its industry-leading services and products. NexLogic is prepared to deliver on all levels of Pb-Free PCB assembly services.

Our PCB Design Services are being utilized in a variety of industries, including medical, military/defense, semi-conductors, telecom, commercial, and oceanographic.

Our Clients Include:
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