Category Archives: Technical Publications

Embedded: Seven ways to avoid embedded PCB engineering change orders

Engineering change orders (ECOs) drive up design costs and result in numerous delays in product development that in turn result in costly extension of time to market. However, most ECOs can be avoided by paying careful attention to seven critical areas where problems frequently occur: component selection, memory, moisture sensitivity levels (MSL), design for test […]

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EET Asia: Saving embedded PCB design with forensic tech

Ever shrinking printed circuit boards (PCBs) populated with greater numbers of package-on-package (PoP) devices have made it more challenging for design engineers to find causes of system failures. After spending many hours or days trying to uncover design defects and flaws using traditional methods such as automated optical inspection (AOI) or x-ray, design engineers may […]

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PCD&F: Using Forensics to Improve PCB Design and Assembly

X-ray and AOI, along with related equipment, have long been the stalwarts of post-placement printed circuit board inspection. Over the years, as packaging, device and board technologies have advanced, these inspection technologies have advanced as well to present the best inspection results possible based on the technology of the day. These inspection machines are nondestructive, […]

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Embedded: Saving your embedded printed circuit board design with forensic technology

Continually shrinking printed circuit boards (PCBs) populated with greater numbers of package-on-package (PoP) devices have made it tougher for design engineers to locate causes of system failures. After spending many hours or days trying to uncover design defects and flaws using traditional methods such as automated optical inspection (AOI) or x-ray, design engineers may simply […]

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SMT: Zulki’s PCB Nuggets – FAI – An Ounce of Prevention, Worth a Pound of Cure

Shrinking PCB real estate, ultrafine-pitch devices, package-on-package technologies, thinner boards, and the recent adoption of challenging device packaging give the use of first article inspection greater importance. Read More

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Critical guidelines for RF and microwave PCB Design

A few decades ago, there wasn’t much demand for RF and microwave circuits. They were difficult to design into the architectures of the time, and so costly that only mil/aero projects could afford them. But today RF circuitry is crammed into a large variety of commercial products. Most of these are handheld wireless devices for […]

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Zulki’s PCB Nuggets: The Intricacies of RF Design & Assembly

Decades ago, successfully and economically completing an RF design was a monumental, almost impossible task due to the fact that much of the necessary technology and know-how were not available. Consequently, great demand for such design just didn’t exist, although most focused on costly applications going to high-end industrial and mil/aero applications. Today, the demand […]

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High-Reliability PCBs in Mil/Aero Applications

PCB design, fabrication, and assembly for mil/aero, medical, and other high-reliability applications demand considerably more than the routine processes and procedures being used for commercial applications. That’s because these special breeds of PCBs require the highest available quality, reliability, and consistency to comply with stringent and rugged environmental requirements. Experienced EMS providers and contract manufacturers […]

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Zulki’s PCB Nuggets: Critical Aspects of a Thermal Profile

In this day and age, the technologies and know-how going into PCB assembly are dramatically escalating and, for some assemblers, it’s difficult to keep up with those advancements. Take, for example, the thermal profile, one of the most important yet constantly changing elements in the PCB assembly process. Unfortunately, there’s still a belief in our […]

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Building quality & signal integrity into PoP-based PCB design & assembly

New ways of working with sub-assembly printed circuit board (PCB) design and assembly have become necessary to design effectively for the new era of package-on-package (PoP) technology. Following the new design guidelines and assembly procedures for high density ICs fabricated with nanometer-scale geometries will assure that an OEM’s product will meet its performance objectives. Read […]

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