Category Archives: Technical Publications

Zulki’s PCB Nuggets: The Intricacies of RF Design & Assembly

Decades ago, successfully and economically completing an RF design was a monumental, almost impossible task due to the fact that much of the necessary technology and know-how were not available. Consequently, great demand for such design just didn’t exist, although most focused on costly applications going to high-end industrial and mil/aero applications. Today, the demand […]

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High-Reliability PCBs in Mil/Aero Applications

PCB design, fabrication, and assembly for mil/aero, medical, and other high-reliability applications demand considerably more than the routine processes and procedures being used for commercial applications. That’s because these special breeds of PCBs require the highest available quality, reliability, and consistency to comply with stringent and rugged environmental requirements. Experienced EMS providers and contract manufacturers […]

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Zulki’s PCB Nuggets: Critical Aspects of a Thermal Profile

In this day and age, the technologies and know-how going into PCB assembly are dramatically escalating and, for some assemblers, it’s difficult to keep up with those advancements. Take, for example, the thermal profile, one of the most important yet constantly changing elements in the PCB assembly process. Unfortunately, there’s still a belief in our […]

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Building quality & signal integrity into PoP-based PCB design & assembly

New ways of working with sub-assembly printed circuit board (PCB) design and assembly have become necessary to design effectively for the new era of package-on-package (PoP) technology. Following the new design guidelines and assembly procedures for high density ICs fabricated with nanometer-scale geometries will assure that an OEM’s product will meet its performance objectives. Read […]

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Quality Management: Key to Medical Electronics Assembly and Manufacturing

No other industry in the US is under more pressure than medical electronics, and those pressures continue mounting each year for greater innovation and products that are faster, better, at lower cost, and in total compliance with regulatory standards. Those standards are becoming more stringent and more demanding of medical electronics OEMs each year. Read […]

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Stepping Out With 0.4mm Pitch BGA/PoPs

Package-on-package is a method of stacking components atop one another. Some OEMs use PoP to reduce the board real estate area, particularly for small handheld products and devices. Others are moving to PoP because end-markets demand greater performance in smaller systems and products. In either case, OEMs will find that there’s a game changer going […]

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Zulki’s PCB Nuggets: Get a New View on X-Ray

It used to be that original equipment manufacturers (OEMs) didn’t know much about X-ray at the PCB assembly stage–they didn’t care too much about it or it just wasn’t on their priority list as a key step for achieving PCB assembly reliability. After all, X-ray is in the domain of the contract manufacturer (CM) or […]

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Ultra-fine pitch devices pose new PCB design issues

Ball-grid array (BGA) packages come in a variety of pitches and sizes. As device complexity increases and OEMs continue their drive toward smaller components, ball pitches of 0.5 mm and lower are becoming more popular. Pitch is defined as the space between the center of one BGA ball to the center of the next one. […]

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MEMS/SMT Hybrid PCBs Take Design/Assembly Detour

The main thrust of microelectronics, since their inception, has been continual miniaturization to make chips, PCBs, and systems smaller, faster, increasingly functional, and more reliable. Subsequently, microelectromechanical systems (MEMS) came into the electronics industry limelight with significant benefits. Today, hybrid MEMS/surface mount technology (SMT) subsystems on PCBs are making greater inroads into OEM markets.When you […]

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Thermal Profiling Small PCBs

Perfect thermocouple placement is necessary for optimized profiles. Growing numbers of printed circuit boards are now denser and smaller to comply with wireless and portable applications, bringing a new round of challenges to create the proper thermal profiles. Even the smallest boards come in a vast number of sizes, shapes and thicknesses, and each requires […]

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