Category Archives: Technical Publications

SMT: Zulki’s PCB Nuggets – EMS Discovers Mature IC Technologies

Did you know that really new, up-to-the-moment PCB technologies are nesting on the doorstep of PCB assemblers? In fact, some of these technologies are very mature, but they’re new to PCB assemblers. For the past year or so, we’ve been talking about package-on-package (PoP) and 0.4 to 0.3-mm pitch BGAs as new technologies, and certainly […]

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Circuits Assembly: Yardsticks for Gauging AOI Effectiveness

Capital spending is an internal issue EMS providers constantly grapple with. At the back of the minds of the decision-makers are a host of related and nagging questions. Can we make do with existing equipment? What are our tradeoffs? Will we lose money using older assembly equipment? How will customers perceive older equipment? Can we […]

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Careful Design Steps Critical for LED PCBs

Although LEDs are steadily growing more popular in many applications, in recent years that growth has greatly and dramatically accelerated. This is due to the explosion of smartphones, iPods, and tablets, as well as other similar small and portable products for consumer, industrial, military, aerospace, and commercial markets. The ever shrinking liquid crystal display (LCD) […]

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ECN: PoP-based PCBs move to center stage

Package-on-package (PoP) technology is coming on strong and continues to overshadow the ever popular system-on-chip (SoC) and other similar packaging types. The rationale behind PoP is simple. More OEMs are miniaturizing their products, but are intent on adding more functionality. Hence, the only way to go to meet these challenges is to make the printed […]

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SMT: Zulki’s PCB Nuggets – Another Look at AOI

PCB inspection is taking on greater significance as boards and packaging become increasingly smaller, with greater functionality. Automated optical inspection (AOI) and its backup associate, X-ray, team up to catch a variety of board assembly problems. But it’s AOI that’s at the forefront of this process. Read More

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SMT: Zulki’s PCB Nuggets – ECOs Reviewed – The Importance of Accuracy

Engineering change orders (ECOs) have been part of the product development and PCB landscapes for as far back as one can remember. Particularly, when it comes to ECOs for PCBs, there are varying and endless reasons for these changes. Certainly, PCB designers can perfectly layout a design and, in theory, follow written specifications to the […]

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Embedded: Seven ways to avoid embedded PCB engineering change orders

Engineering change orders (ECOs) drive up design costs and result in numerous delays in product development that in turn result in costly extension of time to market. However, most ECOs can be avoided by paying careful attention to seven critical areas where problems frequently occur: component selection, memory, moisture sensitivity levels (MSL), design for test […]

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EET Asia: Saving embedded PCB design with forensic tech

Ever shrinking printed circuit boards (PCBs) populated with greater numbers of package-on-package (PoP) devices have made it more challenging for design engineers to find causes of system failures. After spending many hours or days trying to uncover design defects and flaws using traditional methods such as automated optical inspection (AOI) or x-ray, design engineers may […]

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PCD&F: Using Forensics to Improve PCB Design and Assembly

X-ray and AOI, along with related equipment, have long been the stalwarts of post-placement printed circuit board inspection. Over the years, as packaging, device and board technologies have advanced, these inspection technologies have advanced as well to present the best inspection results possible based on the technology of the day. These inspection machines are nondestructive, […]

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Embedded: Saving your embedded printed circuit board design with forensic technology

Continually shrinking printed circuit boards (PCBs) populated with greater numbers of package-on-package (PoP) devices have made it tougher for design engineers to locate causes of system failures. After spending many hours or days trying to uncover design defects and flaws using traditional methods such as automated optical inspection (AOI) or x-ray, design engineers may simply […]

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