Category Archives: Technical Publications

Flex Circuit Design Primer for Wearable/IoT Device

It’s a brand new ballgame with flex circuitry and wearable/IoT devices, so you have to add to your existing knowhow re conventional PCB design. Today, technology trends are increasingly toward flex circuits or a combination of rigid-flex circuits for wearable/IoT PCB designs. You can say those trends put us on a different footing, so to […]

Continue Reading...

Assembling Wearable Electronics

With the exception of a few critical steps, assembling circuit boards for wearable electronics is no different than assembling conventional circuitry. Wearable electronics initially trickled into the market with Dick Tracy-inspired watches and healthcare bracelets. They quickly gained momentum, however, and it wasn’t long before the wearables market exploded. Today’s wearables—and new products still on […]

Continue Reading...

EEWeb: NexLogic Eyes the Wearable Market with Tiny PCB Packages

While many leading technology companies have no problem finding success by supporting well-established industries, it’s fair to say that it takes a special brand of ambition to choose to approach new and open-ended avenues of innovation instead. Certainly, every industry is subject to its own forces of change and the necessity for creative evolution, it’s […]

Continue Reading...

EETimes: Wearable PCB Designs Require Attention to Fundamentals

In the absence of printed circuit board standards in wearable IoT electronics, hardware developers need to pay close attention to fundamentals. Because of their small size and dimensions, few printed circuit board standards exist for the growing wearable Internet of Things market. Until they emerge, we’ll have to depend on what we have learned about […]

Continue Reading...

EETimes: 7 Tips for Overcoming PCB Electromagnetic Issues

Faced with the challenges of new materials and new components, PCB designers must also deal with continuing electromagnetic compatibility and interference problems. Electromagnetic compatibility (EMC) and related electromagnetic interference (EMI) are two culprits system design engineers have historically kept a sharp eye on, among their myriad of other problematic areas. In particular, both are hampering […]

Continue Reading...

EEWeb: Avoiding FLUX RESIDUE in Advanced PCB Designs

Today’s advanced PCB technologies demand more aggressive steps in cleaning up residues left by conventional no-clean flux cleaning processes. Read More

Continue Reading...

Medical Design Briefs: DOEs Rescue Questionable Medical Electronics PCBs

Board cleaning is perhaps one of the most overlooked aspects of printed circuit board (PCB) assembly. But savvy medical electronics original equipment manufacturers (OEMs) have a keen sense of the importance it plays to ensure their products are free of minuscule flaws, defects, debris, and dust. In special cases, critical examinations must be performed to […]

Continue Reading...

Embedded: Making efficient use of BGA signal routing in PCB designs

Ball grid array (BGA) device packaging is today’s standard for housing a range of highly advanced and complex semiconductor devices like FPGAs and microprocessors. The technology of BGA packaging for embedded designs is steadily advancing to keep up with chipmaker technical advances, with this type of packaging splintering out into standard and micro BGAs. Today, […]

Continue Reading...

Embedded: Avoiding embedded PCB design defects

A number of different solder defects and associated failures in embedded designs are becoming more prevalent due to smaller printed circuit boards (PCBs) as well as shrinking ball size and pitch of ball-grid array (BGA), chip-scale (CSP), and quad-flat no-lead (QFN) packaging… Read More

Continue Reading...

Embedded: Bringing experimental development methods to PCB design and manufacturing

PCB technologies are undergoing a major new evolution unlike anything the industry has seen before. Issues relating to PCB size, shape, complexity, thermal requirements, and shrinking board space are creating design and assembly/manufacturing challenges for the original equipment manufacturers (OEMs), chip and component makers, material suppliers, and the electronic manufacturing services (EMS) providers. The effort […]

Continue Reading...