Category Archives: Technical Publications

Ensure IoT device reliability via die shear strength testing

My last post dealt with IoT printed circuit board wire bond reliability and making sure wire bond connections are properly performed between a bare chip and the PCB or substrate. Beyond that particular subject, there is also so much more technology associated with IoT devices and reliability. Die shear strength is one area demanding increasing […]

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Pinpoint IoT PCB wire bonding reliability

IoT devices are spreading into a variety of markets well beyond the consumer area. These small to medium-size devices are finding their niche in industrial, military aerospace, medical and other associated areas. In such mission-critical applications, the top requirements are for reliability and ruggedness. IoT devices must be well-built and able to withstand considerable wear […]

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Get your wires straight for IoT

Technical terms are used extensively — and sometimes misused — when it comes to IoT devices and the technologies they are rapidly absorbing. One such term is microelectronics, spoken and written about since the day the transistor was invented. Today, microelectronics takes on another name — namely wire bonding, which again isn’t a new technology […]

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PADS accelerates IoT PCB design

IoT is the hottest topic in the marketplace right now. It’s coming into virtually every person’s life in terms of equipment and devices being used. In effect, IoT is automation coming to your doorstep, your home, car and coming into every workplace. Printed circuit board (PCB) design software, more commonly known as “tools,” is the […]

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Key Design Steps for DUT Areas on ATE PCBs

An automatic test equipment (ATE) PCB (a.k.a. a test board) is at the heart of all major test activities targeted at verifying a specific semiconductor chip’s functionality. High-speed automatic test equipment (ATE) printed circuit boards (PCBs) are often called “a different beast” compared to conventional PCBs. This is because a lot of careful design attention […]

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Anatomy of next-gen IoT PCBs

Next-generation IoT printed circuit boards are taking on a completely different anatomy than conventional PCBs thanks to a group of technologies that savvy IoT PCB houses are deploying. The whole idea behind these technologies is to meet the size, performance, reliability and cost demands of advanced IoT devices. These technologies include: High-density interconnect (HDI), Micro […]

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A careful look at RF for your IoT PCBs

IoT devices remain in their infancy, with a lot of questions being asked and experimenting going on. Radio frequency, or RF, is one technology that IoT companies and startups are dialing into to advance state-of-the-art IoT and, in doing so, increasing profit margins for their IoT products. In some cases, there are a lot of […]

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Get the right solder paste for your IoT PCBs

The right solder paste must be used to ensure components are solidly connected to IoT rigid-flex and flex circuit boards. Otherwise, without getting a good handle on solder paste, both large and small IoT product companies may be throwing away thousands of dollars, as the wrong solder paste can create flaws such as shorts, opens […]

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IoT PCB thermal profiles are not created equal

Like all printed circuit boards (PCBs), an IoT rigid-flex or flex circuit undergoes the reflowing process to make necessary circuit connections on those small boards. A correct and accurate thermal profile is the linchpin in this key reflow process. It’s easy to go into all the technical details associated with a thermal profile. But for […]

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Three key criteria in an IoT PCB stencil design

Designing a stencil for a conventional rigid printed circuit board (PCB) is challenging enough in this day and age, but designing a stencil for a much smaller IoT rigid-flex or flex circuit takes on a considerably new meaning. On its surface, a stencil looks a bit like kitchen tinfoil, but is made of extremely thin […]

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