Category Archives: Technical Publications

PADS accelerates IoT PCB design

IoT is the hottest topic in the marketplace right now. It’s coming into virtually every person’s life in terms of equipment and devices being used. In effect, IoT is automation coming to your doorstep, your home, car and coming into every workplace. Printed circuit board (PCB) design software, more commonly known as “tools,” is the […]

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Key Design Steps for DUT Areas on ATE PCBs

An automatic test equipment (ATE) PCB (a.k.a. a test board) is at the heart of all major test activities targeted at verifying a specific semiconductor chip’s functionality. High-speed automatic test equipment (ATE) printed circuit boards (PCBs) are often called “a different beast” compared to conventional PCBs. This is because a lot of careful design attention […]

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Anatomy of next-gen IoT PCBs

Next-generation IoT printed circuit boards are taking on a completely different anatomy than conventional PCBs thanks to a group of technologies that savvy IoT PCB houses are deploying. The whole idea behind these technologies is to meet the size, performance, reliability and cost demands of advanced IoT devices. These technologies include: High-density interconnect (HDI), Micro […]

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A careful look at RF for your IoT PCBs

IoT devices remain in their infancy, with a lot of questions being asked and experimenting going on. Radio frequency, or RF, is one technology that IoT companies and startups are dialing into to advance state-of-the-art IoT and, in doing so, increasing profit margins for their IoT products. In some cases, there are a lot of […]

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Get the right solder paste for your IoT PCBs

The right solder paste must be used to ensure components are solidly connected to IoT rigid-flex and flex circuit boards. Otherwise, without getting a good handle on solder paste, both large and small IoT product companies may be throwing away thousands of dollars, as the wrong solder paste can create flaws such as shorts, opens […]

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IoT PCB thermal profiles are not created equal

Like all printed circuit boards (PCBs), an IoT rigid-flex or flex circuit undergoes the reflowing process to make necessary circuit connections on those small boards. A correct and accurate thermal profile is the linchpin in this key reflow process. It’s easy to go into all the technical details associated with a thermal profile. But for […]

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Three key criteria in an IoT PCB stencil design

Designing a stencil for a conventional rigid printed circuit board (PCB) is challenging enough in this day and age, but designing a stencil for a much smaller IoT rigid-flex or flex circuit takes on a considerably new meaning. On its surface, a stencil looks a bit like kitchen tinfoil, but is made of extremely thin […]

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Transmitting signals in an IoT PCB

Effectively transmitting electronic signals in an IoT product relies heavily on how device packaging, traces, routing and vias are designed in IoT rigid-flex or flex circuitry. Component or device packaging includes micro ball grid arrays (micro BGAs), quad-flat no-leads (QFN) and dual-flat no-leads (DFN). These electronic device packages are less than the size of a […]

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Locking in security at the IoT PCB level

The electronics manufacturing services provider designing and assembling IoT printed circuit boards must have a comprehensive understanding of today’s electronics that contribute to an IoT device’s security. Certainly, a great number of software vendors are supporting the IoT products businesses with their versions of security software. However, from a hardware point of view, chipmakers are […]

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Pump up high reliability for IoT PCBs

The demand for and technology of IoT devices are rapidly passing the consumer market and landing squarely in medical electronics, IT/enterprise, industrial and military markets. And those IoT markets are experiencing dramatic growth. However, those markets are highly demanding when it comes to high reliability. IoT devices in these instances must be reliable to the […]

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