Category Archives: Technical Publications

IoT PCB thermal profiles are not created equal

Like all printed circuit boards (PCBs), an IoT rigid-flex or flex circuit undergoes the reflowing process to make necessary circuit connections on those small boards. A correct and accurate thermal profile is the linchpin in this key reflow process. It’s easy to go into all the technical details associated with a thermal profile. But for […]

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Three key criteria in an IoT PCB stencil design

Designing a stencil for a conventional rigid printed circuit board (PCB) is challenging enough in this day and age, but designing a stencil for a much smaller IoT rigid-flex or flex circuit takes on a considerably new meaning. On its surface, a stencil looks a bit like kitchen tinfoil, but is made of extremely thin […]

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Transmitting signals in an IoT PCB

Effectively transmitting electronic signals in an IoT product relies heavily on how device packaging, traces, routing and vias are designed in IoT rigid-flex or flex circuitry. Component or device packaging includes micro ball grid arrays (micro BGAs), quad-flat no-leads (QFN) and dual-flat no-leads (DFN). These electronic device packages are less than the size of a […]

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Locking in security at the IoT PCB level

The electronics manufacturing services provider designing and assembling IoT printed circuit boards must have a comprehensive understanding of today’s electronics that contribute to an IoT device’s security. Certainly, a great number of software vendors are supporting the IoT products businesses with their versions of security software. However, from a hardware point of view, chipmakers are […]

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Pump up high reliability for IoT PCBs

The demand for and technology of IoT devices are rapidly passing the consumer market and landing squarely in medical electronics, IT/enterprise, industrial and military markets. And those IoT markets are experiencing dramatic growth. However, those markets are highly demanding when it comes to high reliability. IoT devices in these instances must be reliable to the […]

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Anatomy of ATE PCB Assembly

An automatic test equipment (ATE) PCB (a.k.a. a test board) is at the heart of all major test activities targeted at verifying a specific semiconductor chip’s functionality. Semiconductor chip technology has become so advanced that testing these highly complex devices must be performed effectively to ensure high reliability and functionality. This allows chipmakers to convey […]

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Ultra-clean IoT PCBs assure high reliability

IoT devices going into military/aerospace, medical and/or highly specialized industrial applications demand ultra-high reliability so they operate properly according to their tight specifications. That means the small IoT printed circuit boards (PCBs) must be ultra-clean and virtually free of any contaminants or chemical residues. But to understand how best to gain that IoT reliability, we […]

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IoT PCB considerations for startups

Since IoT devices are so new, you would think that getting an IoT printed circuit board (PCB) project off the ground starts by reinventing the wheel and going through a lot of technical hassle. That is definitely not true. But it doesn’t mean IoT startups have a clear path to stardom. Facing them is a […]

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Three types of IoT PCBs: Class I, Class II and Class III

Just like the big boys (meaning conventional printed circuit boards), IoT PCBs fall under the categories of Class I, II and III. Earlier, I noted that Class I IoT PCBs are pretty routine; those end applications cover virtually every consumer wearable you can think of. Class I IoT PCBs don’t demand a great measure of […]

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Far East IoT PCB fabrication: Don’t get your hopes too high

Buyer-beware caution comes at a time when growing numbers of entrepreneurs are trying to grab a share of the burgeoning IoT market. As we all know, IoT technology is branching out into a multitude of markets and then even branching out further within certain markets — like medical electronics, manufacturing, military/aerospace and others — well […]

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