Category Archives: Resource Center

Let’s Look At Wearable PCBs Once Again

We talked to you about wearable PCBs in our November TOTM. But that’s not the end of the story since there’s so much to say about those particular very small PCBs. And we have the experience to share new developments with you. We’re seeing increasingly greater interest from our customers for taking the next big […]

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Quality: Foremost Requirement for Medical Electronics PCBs

The terms “quality,” “repeatability,” and “reliability” are inextricably intertwined for medical electronics PCBs. There’s absolutely no question that these requirements must be woven into design and manufacture practices. They take on new meaning today as tiny boards move into a growing number of wearable devices. Many of them are medical electronics devices created to help […]

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Not all Wearables PCBs are Created Equal

Don’t be fooled into thinking that designing a wearable PCB is always the same. There are differences. As they become more popular, newer PCB design and manufacturing challenges will surface. Wearables and today’s associated technologies are gaining greater traction. Everywhere you turn, there’s a new wearable device with applications ranging from health and fitness monitoring […]

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Combating EMI Head On!

Electromagnetic compatibility (EMC) and its associated troublesome pal, electromagnetic interference (EMI) are and have been part of your PCB design issue package since day one. With the introduction of shrinking PCBs and smaller packaging, EMC and EMI are working overtime to cause you larger headaches. For refresher purposes, EMC is related with the generation, propagation, […]

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Fine Pitch BGA Design Guidelines

Today’s smaller packaging can create confusion within the PCB designer ranks. When designing with BGAs with pitch sizes of 0.5mm and above, there are certain rules of thumb related to pad sizes and solder mask opening. One is to maintain pad size to about 85 % of a BGA’s ball size. Another is to use […]

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Improving Yields Through Design For Testability (DFT)

In our industry, design for test (DFT) and design-for-manufacturing (DFM) aren’t always copacetic, as you may have experienced with your previous PCB projects. Put another way, PCB test engineering isn’t always aligned with PCB manufacturing. Someone or some ones drop the ball along the line. When manufacturing personnel test the assembly of a particular board, […]

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PCB Cleaning Gets New Meanings

PCB Technology has advanced so much that even the board cleaning process literally takes on new meanings. In short, this means if proper cleaning agents aren’t applied, a board may still have flux and solder paste residues trapped inside the small cavities. In turn, this hinders the board’s optimal performance since transmission and return signals […]

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Best To Get A Fix On Third Level PCB Assembly

A majority of OEMs may be lulled into thinking that PCB assembly remains relatively static with little to no change. However, a new level three is beginning to be recognized on the assembly floor. In this case, OEM customer expectations aren’t clearly defined either to the EMS Provider or even to themselves. At level one, […]

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Get the low-down on BGA fan-out techniques for improved PCB designs

Ball-grid array or BGA packaging has become so advanced and sophisticated technology-wise that PCB design and layout engineering expertise is critical to avoid design issues that later surface on the PCB assembly and manufacturing floor. The top job for the PCB designer is to carefully investigate a board design and develop appropriate fan-out strategies that […]

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Arm Yourself Against PCB Defects

The OEM drive to better, smaller, more complex, and higher performance PCBs is taking its toll on quality and reliability unless the EMS provider’s design and assembly team continually stays on top of the newer PCB technologies that are increasingly being used. Different solder defects and related failures are surfacing more due to smaller boards […]

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