Category Archives: Resource Center

Improving Yields Through Design For Testability (DFT)

In our industry, design for test (DFT) and design-for-manufacturing (DFM) aren’t always copacetic, as you may have experienced with your previous PCB projects. Put another way, PCB test engineering isn’t always aligned with PCB manufacturing. Someone or some ones drop the ball along the line. When manufacturing personnel test the assembly of a particular board, […]

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PCB Cleaning Gets New Meanings

PCB Technology has advanced so much that even the board cleaning process literally takes on new meanings. In short, this means if proper cleaning agents aren’t applied, a board may still have flux and solder paste residues trapped inside the small cavities. In turn, this hinders the board’s optimal performance since transmission and return signals […]

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Best To Get A Fix On Third Level PCB Assembly

A majority of OEMs may be lulled into thinking that PCB assembly remains relatively static with little to no change. However, a new level three is beginning to be recognized on the assembly floor. In this case, OEM customer expectations aren’t clearly defined either to the EMS Provider or even to themselves. At level one, […]

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Get the low-down on BGA fan-out techniques for improved PCB designs

Ball-grid array or BGA packaging has become so advanced and sophisticated technology-wise that PCB design and layout engineering expertise is critical to avoid design issues that later surface on the PCB assembly and manufacturing floor. The top job for the PCB designer is to carefully investigate a board design and develop appropriate fan-out strategies that […]

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Arm Yourself Against PCB Defects

The OEM drive to better, smaller, more complex, and higher performance PCBs is taking its toll on quality and reliability unless the EMS provider’s design and assembly team continually stays on top of the newer PCB technologies that are increasingly being used. Different solder defects and related failures are surfacing more due to smaller boards […]

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Got pressing questions about future PCB technologies? Check out DOEs!

Major changes are occurring in PCB design, fabrication, assembly, and manufacturing. In effect, there is virtually no more status quo. Traditional boards have basically been the same size with about the same components as other PCBs. That meant design, fabrication, assembly, and manufacturing basically followed the same steps and procedures. But in the last few […]

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Best To Send CAD Data, Not Gerber Files

Panelization and de-panelization are becoming more common on the PCB assembly floor. Panelization is used to process increasingly smaller boards through assembly steps to deal with the growing OEM demand for smaller, more compact products. Known as processing PCBs in array format, panelization keeps small boards attached to each other in a multiple boards format, […]

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Extra PCB Design emphasis placed on RF and Microwave

RF and microwave circuits were rarely used on conventional PCBs in earlier days. But now, they are commonplace given the fact OEMs heavily rely on these high frequency devices for newer portable communications products. Consequently, the PCB layout designer must concentrate on a variety of issues when designing PCBs with high- frequency RF and microwave […]

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Get The Latest On DFM Issues

You’ve probably heard it a million times. That is PCB design/layout engineers must communicate with assembly and manufacturing engineering. Easy to say, but in many case, it’s hard, especially when you’re working with separate PCB design and assembly houses. And also, DFM is often neglected for any number of reasons. What is worse is that […]

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Get A Closer Look At AOI

Automated optical inspection (AOI) systems for your PCB inspection are not created equal. Therefore, it’s crucial that you get a better perspective on AOI simply because it plays an increasingly more vital role today. Obviously, some AOI systems currently are older generation at offshore assemblers as well as those in the U. S. Plus, some […]

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