Category Archives: Resource Center

Flex Circuits Offer The Best Of All Worlds

The growing NexLogic customer demand for the design and manufacturing of wearables and Internet of Things (IoT) is dramatically expanding our flex circuitry design and manufacturing experience base. Not long ago, flex circuitry was considered a required item for a particular PCB design. However, today, it is taking center stage and is mainstream, not only […]

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ITAR Kept Tight

NexLogic is ITAR certified for PCB layout, fabrication, and assembly and has been since 2000. ITAR stands for the International Traffic In Arms Regulations, which are U. S. State Department controls regulating the U. S. defense industry. In short, ITAR sets up the critical assurances that U. S. technology used for defense and mil/aero applications […]

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FAI – Top Priority for Top Quality PCB Manufacturing

As shown in Fig. 1, first article inspection or FAI takes a back seat at best in a number of today’s PCB assembly and manufacturing operations. At times, it falls victim to large engineering egos with a strong belief that a particular PCB is “a simple, easy board” that doesn’t require extra time and expense […]

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Get Ready For The Big Surge in Wearable PCBs

With all the attention to health and fitness, a lot of people think the wearables market has hit a plateau. Actually, the wearable devices market today is only the tip of the iceberg. The fact is numbers of OEMs producing traditional electronics systems have a close eye on creating their own versions to further turbo-charge […]

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Accurate Component Placement – More Critical Than Ever

Component placement is taking center stage more so today than ever before. Why? The reason is increasing numbers of different package types and sizes are now used due to shrinking PCBs. The pick and place operation during PCB assembly is demanding greater attention as a result. This means placement demands a well-disciplined list of checks, […]

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Let’s Look At Wearable PCBs Once Again

We talked to you about wearable PCBs in our November TOTM. But that’s not the end of the story since there’s so much to say about those particular very small PCBs. And we have the experience to share new developments with you. We’re seeing increasingly greater interest from our customers for taking the next big […]

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Quality: Foremost Requirement for Medical Electronics PCBs

The terms “quality,” “repeatability,” and “reliability” are inextricably intertwined for medical electronics PCBs. There’s absolutely no question that these requirements must be woven into design and manufacture practices. They take on new meaning today as tiny boards move into a growing number of wearable devices. Many of them are medical electronics devices created to help […]

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Not all Wearables PCBs are Created Equal

Don’t be fooled into thinking that designing a wearable PCB is always the same. There are differences. As they become more popular, newer PCB design and manufacturing challenges will surface. Wearables and today’s associated technologies are gaining greater traction. Everywhere you turn, there’s a new wearable device with applications ranging from health and fitness monitoring […]

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Combating EMI Head On!

Electromagnetic compatibility (EMC) and its associated troublesome pal, electromagnetic interference (EMI) are and have been part of your PCB design issue package since day one. With the introduction of shrinking PCBs and smaller packaging, EMC and EMI are working overtime to cause you larger headaches. For refresher purposes, EMC is related with the generation, propagation, […]

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Fine Pitch BGA Design Guidelines

Today’s smaller packaging can create confusion within the PCB designer ranks. When designing with BGAs with pitch sizes of 0.5mm and above, there are certain rules of thumb related to pad sizes and solder mask opening. One is to maintain pad size to about 85 % of a BGA’s ball size. Another is to use […]

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