Category Archives: Resource Center

A Word to the Wise — Don’t Be Misled By Poorly Viewed Solder Joints

Smaller packaging and considerably reduced PCB real estate is placing greater customer attention on lead-free solder joints. And in many cases, concerns — and even becoming alarmed — over what is seen in highly magnified views can be misleading and unproductive. If solder joints meet IPC-A- 610 Standard, Class III, they are good to go. […]

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Package on Package or PoP Gaining Greater Ground

The new era of package on package or PoP technology ushers in new and different ways of dealing with sub-assembly PCB design and assembly. By not abiding by these new and evolving design guidelines and assembly procedures, chances are pretty high an OEM’s product can significantly fall short of its performance objectives. Maintaining high reliability […]

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Tighter Scrutiny Needed for PCB Cleaning Agents

Unfortunately, today’s advanced PCB technologies can pose costly latent issues that ultimately surface when a product is in the field. That’s why cleaning methodologies, testing analysis, and special chemistries are being refined and taken to a new level. Doing so is crucial to assure OEMs and their end products of ultra clean boards to avoid […]

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Fill Up Through Holes in IoT Rigid-Flex and Flex Circuits

Requirements for Class III IoT devices are very specific. IoT applications falling into this category include mil/aero and medical electronics. In the assembly process for any type of PCB, either surface mount technology or through hole is used to place components onto an IoT rigid-flex or flex circuit. As the name implies, surface mount is […]

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Special Care For Wearable/IoT Flex Circuit Via Placement

Via placement for wearable/IoT flex circuitry is a bit tricky. There are certain rules you must follow. First and foremost, the number of vias has to be limited simply because space is limited. If too many vias are placed, you’re likely blocking critical space for routing traces. Vias go through a lot of fatigue due […]

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Get a Grip on Wearable/IoT PCB Terminology

Wearable/IoT PCB technology is ushering in new design terminology and steps that need to be factored in. Two particular areas that need to be understood deals with (1) low and high modulus boards and (2) flex circuit bending. Board modulus refers to its structure; low modulus means a softer structure, while high modulus refers to […]

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Micro BGA Gains Popularity for Wearable/IoT PCBs

With the increasing demands for wearable and Internet of Things (IoT) devices, chipmakers are scrambling to yet pack even more circuitry into even smaller component packaging. The micro ball-grid array (BGA) package is a case in point. Fig. 1 shows micro BGA-packaged devices placed on a flex circuit for a medical electronics application. These tiny […]

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Advanced Packaging Reshaping PCB Landscape

Can you imagine component packaging so small you can barely see it. And if you accidentally sneeze while trying to see it, it’s literally blown away forever. You’ll never find it. Active and passive device packaging of those dimensions is what you’ll be dealing with as PCB technology continues to move forward into increasingly smaller […]

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SPI A Must For Fine-Pitch Devices

Solder paste deposition 100% accuracy is especially important for PCBs that are highly populated with fine-pitch devices like QFNs, BGAs, and tiny passive component packages like 0201 and 00105. Those packages have very little pad area. Therefore, registration must be precise and accurate. If you’re dealing with a 01005 pad and if registration is off […]

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Perfect Thermal Profile for Wearable/IoT PCB

Creating a perfect thermal profile for a wearable/IoT PCB undergoing the reflow process is a challenge. That challenge is based on the fact wearable flex PCBs are smaller, and they don’t have sufficient thermal mass compared to conventional rigid PCBs. Also, they have different thicknesses and when it comes to flex, even different thicknesses, where […]

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