Wire bonding has been inextricably linked to semiconductor assembly and connecting the chip with its package. Today, wire bonding technology is used in PCB assembly simply because OEM demands are for increasingly smaller products and the boards they’re based on. Products like IoT devices and wearables are based on small rigid or a combination of […]Continue Reading...
ISO 13485 is about potential risks involved and mitigating them during and after the building of medical products. It is a specific ISO standard serving as a comprehensive management system for the design and manufacture of medical devices. Like other ISO standards, its focus is on continuous improvement in process and quality systems. Also, a […]Continue Reading...
NexLogic Technologies, Inc. is a full service EMS Provider including printed circuit board (PCB) design, fabrication, assembly and manufacturing, and microelectronics assemblies. The company serves commercial, mil/aero, medical electronics, and consumer markets. Its OEM, ODM and semiconductor company customers partner with NexLogic on their conventional, automatic testing equipment (ATE), wearable, and IoT PCBs. Continue readingContinue Reading...
When you think printed circuit boards (PCBs) cannot get any smaller, they continue to do so, especially in this day and age when IoT devices are springing up everywhere. See Fig. 1 for examples of denser and smaller PCBs. The smaller the PCB, the more challenges associated with creating the correct thermal profiles. It’s especially […]Continue Reading...
Automated optical inspection (AOI) systems represent a prime example of the valuable and effective equipment demanded on today’s assembly floor. The foremost reason is the extraordinarily small component packaging and ever-shrinking PCB size that require the most sophisticated AOI solutions possible to detect flaws and defects during the assembly process. AOI is well suited for […]Continue Reading...
Conventional PCB design substantially differs from the design of a high-speed automatic test equipment (ATE) PCB. It’s better known to semiconductor companies as a “test board” that tests and verifies the functionality and operation of a newly developed chip like an advanced system-on-a-chip, FPGA, µP or other highly prized integrated circuit. The device-under-test or DUT […]Continue Reading...
Going from a PCB design house to a non-associated PCB assembly house often poses a problem for the OEM customer. Simply put, design-for-manufacturing or DFM is completely neglected. A number of PCB design mis-steps can occur at layout, especially when you have inexperienced designers who have good intentions, but fail to understand the nuances of […]Continue Reading...
The most important and difficult aspect of printed circuit board (PCB) designs using fine pitch BGAs is the layout of their lands and fan-outs. Pitch is defined as the space between the center of one BGA ball to the center of the next one. Micro BGAs with 0.3 mm pitch BGAs are found in virtually […]Continue Reading...
Micro BGAs are proving exceedingly popular these days. These small packages are not only populating conventional PCBs that continue to increase in complexity, but also the smaller circuit boards for IoT and wearable devices. The micro BGA package is more compact than other SMT devices and hence, has a shorter contact length from the device […]Continue Reading...
Signal escape routing associated with the highly advanced ball-grid array (BGA) package is definitely not an easy task. Rather it’s highly challenging and poses critical PCB designer decisions along the multitudes of routes involved in getting those signals out. One has to keep in mind that PCBs continue to become smaller, especially those rigid-flex and […]Continue Reading...