Category Archives: Resource Center

Light Up Your LED PCB Projects

LEDs are the light of choice for growing numbers of applications due to their shrinking size, as well as declining cost and longer life. But LEDs pose a host of issues to the PCB layout designer including thermal management challenges. Within thermal management, there are a few other key issues to ponder. Those involve PCB […]

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Here’s The Low Down On PCB Thermal Management

PCB thermal management has long been considered secondary to signal integrity. However, we’re now seeing a greater, more dramatic evolution of power densities in transistors. Consequently, PCB thermal management is today a major issue. The main purpose of thermal management is to drain enough heat away from device’s active region efficiently so that the device […]

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Update on PCB Stencil Design and Printing

Stencil design and printing is one of the most important steps when it comes to PCB assembly. Knowing how to properly design the stencil and implement paste dispensing for assembly takes considerable knowhow and in-depth experience. In this instance, there’s no substitute for experience since textbooks on the subject are few and far between. Take […]

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Component Placement More Critical Than Ever

We’re now talking about BGA-packaged components with 4,000 or so leads or balls, 0.3mm pin pitch and below, highly component populated automatic test equipment PCBs, and ever shrinking conventional PCBs and small flex circuits for Internet of Things (IoT) and wearables. That tells you that component placement on these PCBs at the pick and place […]

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Proper Decoupling Capacitor Placement For Signal Integrity

Signal integrity demands considerable attention due to the increasing complexity of PCB designs and the highly advanced digital and analog components OEM system houses require. There are countless areas a PCB layout engineer can overlook, thus creating signal integrity issues One especially important aspect is proper decoupling capacitors for BGA consideration. It is recommended that […]

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Check Out Thermal Management Considerations

There are a number of considerations an experienced PCB designer applies for thermal management. However, the key design steps essential for effectively dissipating heat are: Properly distributing analog circuitry throughout the board. Effectively using ground pour on the PCB. Strategically deploying thieving, when possible. Considering a metal core (MC) board, if applicable. Creating more solid […]

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A Dip in Ionic Contamination Test Keeps Mil/Aero PCBs 99.9% Clean

Whether we like it or not, ions are part of electronics manufacturing. And, in simple language, they are bad for electronics manufacturing. When applying pressure or water-based film on electronics circuitry with alloys on top of component leads, in due time, ions can lead to corrosion and dendrite growth. That, in turn, results in certain […]

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Efficiently Using BGA Signal Routing

BGA packaging technology is steadily advancing, especially for wearable and IoT rigid-flex and flex circuitry. Today, both standard and micro BGA types deal with increasing numbers of I/Os, and this means signal escape routing is difficult and challenging, even for experienced printed circuit board (PCB) designers. A major portion of a BGA populated PCB design […]

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A Word to the Wise — Don’t Be Misled By Poorly Viewed Solder Joints

Smaller packaging and considerably reduced PCB real estate is placing greater customer attention on lead-free solder joints. And in many cases, concerns — and even becoming alarmed — over what is seen in highly magnified views can be misleading and unproductive. If solder joints meet IPC-A- 610 Standard, Class III, they are good to go. […]

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Package on Package or PoP Gaining Greater Ground

The new era of package on package or PoP technology ushers in new and different ways of dealing with sub-assembly PCB design and assembly. By not abiding by these new and evolving design guidelines and assembly procedures, chances are pretty high an OEM’s product can significantly fall short of its performance objectives. Maintaining high reliability […]

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