Author Archives: nexlogic

Fill Up Through Holes in IoT Rigid-Flex and Flex Circuits

Requirements for Class III IoT devices are very specific. IoT applications falling into this category include mil/aero and medical electronics. In the assembly process for any type of PCB, either surface mount technology or through hole is used to place components onto an IoT rigid-flex or flex circuit. As the name implies, surface mount is […]

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Special Care For Wearable/IoT Flex Circuit Via Placement

Via placement for wearable/IoT flex circuitry is a bit tricky. There are certain rules you must follow. First and foremost, the number of vias has to be limited simply because space is limited. If too many vias are placed, you’re likely blocking critical space for routing traces. Vias go through a lot of fatigue due […]

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Three types of IoT PCBs: Class I, Class II and Class III

Just like the big boys (meaning conventional printed circuit boards), IoT PCBs fall under the categories of Class I, II and III. Earlier, I noted that Class I IoT PCBs are pretty routine; those end applications cover virtually every consumer wearable you can think of. Class I IoT PCBs don’t demand a great measure of […]

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Far East IoT PCB fabrication: Don’t get your hopes too high

Buyer-beware caution comes at a time when growing numbers of entrepreneurs are trying to grab a share of the burgeoning IoT market. As we all know, IoT technology is branching out into a multitude of markets and then even branching out further within certain markets — like medical electronics, manufacturing, military/aerospace and others — well […]

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Get a Grip on Wearable/IoT PCB Terminology

Wearable/IoT PCB technology is ushering in new design terminology and steps that need to be factored in. Two particular areas that need to be understood deals with (1) low and high modulus boards and (2) flex circuit bending. Board modulus refers to its structure; low modulus means a softer structure, while high modulus refers to […]

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Flex Circuit Design Primer for Wearable/IoT Device

It’s a brand new ballgame with flex circuitry and wearable/IoT devices, so you have to add to your existing knowhow re conventional PCB design. Today, technology trends are increasingly toward flex circuits or a combination of rigid-flex circuits for wearable/IoT PCB designs. You can say those trends put us on a different footing, so to […]

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Micro BGA Gains Popularity for Wearable/IoT PCBs

With the increasing demands for wearable and Internet of Things (IoT) devices, chipmakers are scrambling to yet pack even more circuitry into even smaller component packaging. The micro ball-grid array (BGA) package is a case in point. Fig. 1 shows micro BGA-packaged devices placed on a flex circuit for a medical electronics application. These tiny […]

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Advanced Packaging Reshaping PCB Landscape

Can you imagine component packaging so small you can barely see it. And if you accidentally sneeze while trying to see it, it’s literally blown away forever. You’ll never find it. Active and passive device packaging of those dimensions is what you’ll be dealing with as PCB technology continues to move forward into increasingly smaller […]

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SPI A Must For Fine-Pitch Devices

Solder paste deposition 100% accuracy is especially important for PCBs that are highly populated with fine-pitch devices like QFNs, BGAs, and tiny passive component packages like 0201 and 00105. Those packages have very little pad area. Therefore, registration must be precise and accurate. If you’re dealing with a 01005 pad and if registration is off […]

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Perfect Thermal Profile for Wearable/IoT PCB

Creating a perfect thermal profile for a wearable/IoT PCB undergoing the reflow process is a challenge. That challenge is based on the fact wearable flex PCBs are smaller, and they don’t have sufficient thermal mass compared to conventional rigid PCBs. Also, they have different thicknesses and when it comes to flex, even different thicknesses, where […]

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