Author Archives: nexlogic

A Dip in Ionic Contamination Test Keeps Mil/Aero PCBs 99.9% Clean

Whether we like it or not, ions are part of electronics manufacturing. And, in simple language, they are bad for electronics manufacturing. When applying pressure or water-based film on electronics circuitry with alloys on top of component leads, in due time, ions can lead to corrosion and dendrite growth. That, in turn, results in certain […]

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Efficiently Using BGA Signal Routing

BGA packaging technology is steadily advancing, especially for wearable and IoT rigid-flex and flex circuitry. Today, both standard and micro BGA types deal with increasing numbers of I/Os, and this means signal escape routing is difficult and challenging, even for experienced printed circuit board (PCB) designers. A major portion of a BGA populated PCB design […]

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A Word to the Wise — Don’t Be Misled By Poorly Viewed Solder Joints

Smaller packaging and considerably reduced PCB real estate is placing greater customer attention on lead-free solder joints. And in many cases, concerns — and even becoming alarmed — over what is seen in highly magnified views can be misleading and unproductive. If solder joints meet IPC-A- 610 Standard, Class III, they are good to go. […]

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Package on Package or PoP Gaining Greater Ground

The new era of package on package or PoP technology ushers in new and different ways of dealing with sub-assembly PCB design and assembly. By not abiding by these new and evolving design guidelines and assembly procedures, chances are pretty high an OEM’s product can significantly fall short of its performance objectives. Maintaining high reliability […]

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Tighter Scrutiny Needed for PCB Cleaning Agents

Unfortunately, today’s advanced PCB technologies can pose costly latent issues that ultimately surface when a product is in the field. That’s why cleaning methodologies, testing analysis, and special chemistries are being refined and taken to a new level. Doing so is crucial to assure OEMs and their end products of ultra clean boards to avoid […]

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IoT PCB considerations for startups

Since IoT devices are so new, you would think that getting an IoT printed circuit board (PCB) project off the ground starts by reinventing the wheel and going through a lot of technical hassle. That is definitely not true. But it doesn’t mean IoT startups have a clear path to stardom. Facing them is a […]

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Fill Up Through Holes in IoT Rigid-Flex and Flex Circuits

Requirements for Class III IoT devices are very specific. IoT applications falling into this category include mil/aero and medical electronics. In the assembly process for any type of PCB, either surface mount technology or through hole is used to place components onto an IoT rigid-flex or flex circuit. As the name implies, surface mount is […]

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Special Care For Wearable/IoT Flex Circuit Via Placement

Via placement for wearable/IoT flex circuitry is a bit tricky. There are certain rules you must follow. First and foremost, the number of vias has to be limited simply because space is limited. If too many vias are placed, you’re likely blocking critical space for routing traces. Vias go through a lot of fatigue due […]

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Three types of IoT PCBs: Class I, Class II and Class III

Just like the big boys (meaning conventional printed circuit boards), IoT PCBs fall under the categories of Class I, II and III. Earlier, I noted that Class I IoT PCBs are pretty routine; those end applications cover virtually every consumer wearable you can think of. Class I IoT PCBs don’t demand a great measure of […]

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Far East IoT PCB fabrication: Don’t get your hopes too high

Buyer-beware caution comes at a time when growing numbers of entrepreneurs are trying to grab a share of the burgeoning IoT market. As we all know, IoT technology is branching out into a multitude of markets and then even branching out further within certain markets — like medical electronics, manufacturing, military/aerospace and others — well […]

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