Author Archives: nexlogic

Anatomy of ATE PCB Assembly

An automatic test equipment (ATE) PCB (a.k.a. a test board) is at the heart of all major test activities targeted at verifying a specific semiconductor chip’s functionality. Semiconductor chip technology has become so advanced that testing these highly complex devices must be performed effectively to ensure high reliability and functionality. This allows chipmakers to convey […]

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Stay Ahead of Smaller PCBs To Maintain Reliability

OEMs continue to demand greater functionality in smaller portable and handheld products, such as wearables and IoT devices. As a result, a number of attributes are demanded these days for PCBs in smaller mobile technologies. Along with those attributes come a host of challenges in terms of layout, fabrication, and assembly, plus assuring many of […]

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Check Out The Thermal Profile For ATE PCBs

ATE PCBs can be up to 0.187-inch thick or even 0.25-inch, with a high layer count that includes a number of ground and power planes and have a lot of gold on the surface (typically 50 micro inches, ENIG) on the tester and DUT pads. The size of the board along with the amount of […]

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Light Up Your LED PCB Projects

LEDs are the light of choice for growing numbers of applications due to their shrinking size, as well as declining cost and longer life. But LEDs pose a host of issues to the PCB layout designer including thermal management challenges. Within thermal management, there are a few other key issues to ponder. Those involve PCB […]

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Ultra-clean IoT PCBs assure high reliability

IoT devices going into military/aerospace, medical and/or highly specialized industrial applications demand ultra-high reliability so they operate properly according to their tight specifications. That means the small IoT printed circuit boards (PCBs) must be ultra-clean and virtually free of any contaminants or chemical residues. But to understand how best to gain that IoT reliability, we […]

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Here’s The Low Down On PCB Thermal Management

PCB thermal management has long been considered secondary to signal integrity. However, we’re now seeing a greater, more dramatic evolution of power densities in transistors. Consequently, PCB thermal management is today a major issue. The main purpose of thermal management is to drain enough heat away from device’s active region efficiently so that the device […]

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Update on PCB Stencil Design and Printing

Stencil design and printing is one of the most important steps when it comes to PCB assembly. Knowing how to properly design the stencil and implement paste dispensing for assembly takes considerable knowhow and in-depth experience. In this instance, there’s no substitute for experience since textbooks on the subject are few and far between. Take […]

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Component Placement More Critical Than Ever

We’re now talking about BGA-packaged components with 4,000 or so leads or balls, 0.3mm pin pitch and below, highly component populated automatic test equipment PCBs, and ever shrinking conventional PCBs and small flex circuits for Internet of Things (IoT) and wearables. That tells you that component placement on these PCBs at the pick and place […]

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Proper Decoupling Capacitor Placement For Signal Integrity

Signal integrity demands considerable attention due to the increasing complexity of PCB designs and the highly advanced digital and analog components OEM system houses require. There are countless areas a PCB layout engineer can overlook, thus creating signal integrity issues One especially important aspect is proper decoupling capacitors for BGA consideration. It is recommended that […]

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Check Out Thermal Management Considerations

There are a number of considerations an experienced PCB designer applies for thermal management. However, the key design steps essential for effectively dissipating heat are: Properly distributing analog circuitry throughout the board. Effectively using ground pour on the PCB. Strategically deploying thieving, when possible. Considering a metal core (MC) board, if applicable. Creating more solid […]

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