Author Archives: nexlogic

Take a New Look at AOI

Automated optical inspection (AOI) systems represent a prime example of the valuable and effective equipment demanded on today’s assembly floor. The foremost reason is the extraordinarily small component packaging and ever-shrinking PCB size that require the most sophisticated AOI solutions possible to detect flaws and defects during the assembly process. AOI is well suited for […]

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ATE PCB Design Not Your Typical PCB Design

Conventional PCB design substantially differs from the design of a high-speed automatic test equipment (ATE) PCB. It’s better known to semiconductor companies as a “test board” that tests and verifies the functionality and operation of a newly developed chip like an advanced system-on-a-chip, FPGA, µP or other highly prized integrated circuit. The device-under-test or DUT […]

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Key Design Steps for DUT Areas on ATE PCBs

An automatic test equipment (ATE) PCB (a.k.a. a test board) is at the heart of all major test activities targeted at verifying a specific semiconductor chip’s functionality. High-speed automatic test equipment (ATE) printed circuit boards (PCBs) are often called “a different beast” compared to conventional PCBs. This is because a lot of careful design attention […]

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Anatomy of next-gen IoT PCBs

Next-generation IoT printed circuit boards are taking on a completely different anatomy than conventional PCBs thanks to a group of technologies that savvy IoT PCB houses are deploying. The whole idea behind these technologies is to meet the size, performance, reliability and cost demands of advanced IoT devices. These technologies include: High-density interconnect (HDI), Micro […]

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Don’t Sabotage Your PCB DFM

Going from a PCB design house to a non-associated PCB assembly house often poses a problem for the OEM customer. Simply put, design-for-manufacturing or DFM is completely neglected. A number of PCB design mis-steps can occur at layout, especially when you have inexperienced designers who have good intentions, but fail to understand the nuances of […]

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Get A Better Grasp of Fine Pitch BGA Design

The most important and difficult aspect of printed circuit board (PCB) designs using fine pitch BGAs is the layout of their lands and fan-outs. Pitch is defined as the space between the center of one BGA ball to the center of the next one. Micro BGAs with 0.3 mm pitch BGAs are found in virtually […]

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Catch Up With Micro BGAs

Micro BGAs are proving exceedingly popular these days. These small packages are not only populating conventional PCBs that continue to increase in complexity, but also the smaller circuit boards for IoT and wearable devices. The micro BGA package is more compact than other SMT devices and hence, has a shorter contact length from the device […]

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A careful look at RF for your IoT PCBs

IoT devices remain in their infancy, with a lot of questions being asked and experimenting going on. Radio frequency, or RF, is one technology that IoT companies and startups are dialing into to advance state-of-the-art IoT and, in doing so, increasing profit margins for their IoT products. In some cases, there are a lot of […]

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Get the right solder paste for your IoT PCBs

The right solder paste must be used to ensure components are solidly connected to IoT rigid-flex and flex circuit boards. Otherwise, without getting a good handle on solder paste, both large and small IoT product companies may be throwing away thousands of dollars, as the wrong solder paste can create flaws such as shorts, opens […]

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Stepping Through BGA Signal Escape Routing

Signal escape routing associated with the highly advanced ball-grid array (BGA) package is definitely not an easy task. Rather it’s highly challenging and poses critical PCB designer decisions along the multitudes of routes involved in getting those signals out. One has to keep in mind that PCBs continue to become smaller, especially those rigid-flex and […]

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