Author Archives: nexlogic

Get A Better Grasp of Fine Pitch BGA Design

The most important and difficult aspect of printed circuit board (PCB) designs using fine pitch BGAs is the layout of their lands and fan-outs. Pitch is defined as the space between the center of one BGA ball to the center of the next one. Micro BGAs with 0.3 mm pitch BGAs are found in virtually […]

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Catch Up With Micro BGAs

Micro BGAs are proving exceedingly popular these days. These small packages are not only populating conventional PCBs that continue to increase in complexity, but also the smaller circuit boards for IoT and wearable devices. The micro BGA package is more compact than other SMT devices and hence, has a shorter contact length from the device […]

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A careful look at RF for your IoT PCBs

IoT devices remain in their infancy, with a lot of questions being asked and experimenting going on. Radio frequency, or RF, is one technology that IoT companies and startups are dialing into to advance state-of-the-art IoT and, in doing so, increasing profit margins for their IoT products. In some cases, there are a lot of […]

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Get the right solder paste for your IoT PCBs

The right solder paste must be used to ensure components are solidly connected to IoT rigid-flex and flex circuit boards. Otherwise, without getting a good handle on solder paste, both large and small IoT product companies may be throwing away thousands of dollars, as the wrong solder paste can create flaws such as shorts, opens […]

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Stepping Through BGA Signal Escape Routing

Signal escape routing associated with the highly advanced ball-grid array (BGA) package is definitely not an easy task. Rather it’s highly challenging and poses critical PCB designer decisions along the multitudes of routes involved in getting those signals out. One has to keep in mind that PCBs continue to become smaller, especially those rigid-flex and […]

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IoT PCB thermal profiles are not created equal

Like all printed circuit boards (PCBs), an IoT rigid-flex or flex circuit undergoes the reflowing process to make necessary circuit connections on those small boards. A correct and accurate thermal profile is the linchpin in this key reflow process. It’s easy to go into all the technical details associated with a thermal profile. But for […]

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Three key criteria in an IoT PCB stencil design

Designing a stencil for a conventional rigid printed circuit board (PCB) is challenging enough in this day and age, but designing a stencil for a much smaller IoT rigid-flex or flex circuit takes on a considerably new meaning. On its surface, a stencil looks a bit like kitchen tinfoil, but is made of extremely thin […]

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Transmitting signals in an IoT PCB

Effectively transmitting electronic signals in an IoT product relies heavily on how device packaging, traces, routing and vias are designed in IoT rigid-flex or flex circuitry. Component or device packaging includes micro ball grid arrays (micro BGAs), quad-flat no-leads (QFN) and dual-flat no-leads (DFN). These electronic device packages are less than the size of a […]

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DOEs Rescue Doubtful Medical Electronics PCBs

Design of experiments or DOEs represent a recent advancement in the continuing challenge for achieving highly reliable medical electronics PCBs. DOEs extend well beyond the extensive nature of a PCB cleaning process. That means DOE practices and procedures focus on investigating and resolving out of the ordinary problems. These are unforeseen and difficult to define […]

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Protecting the DUT During PCB Assembly

The device-under-test or DUT site or sites is the most critical part of an ATE PCB. That’s where a component or chip is placed for testing. There can be one or more DUTs on a board, for instance, four DUTs as shown in Fig. 1. Others can be a dual-site board with two DUTs where […]

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