Author Archives: nexlogic

Failures in IoT PCB wire bond loops

Earlier we talked about wire bond testing for IoT printed circuit boards and the types of wire used to connect a bare chip to a substrate or the PCB surface itself. This discussion deals with wire bond loops pull testing and verification, which is critical for IoT device reliability. Your immediate reaction is probably: What […]

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Get the Know How On Wire Bonding Reliability

Wire bonding has traveled far and wide from the early days of semiconductor manufacturing. That’s when wire bonding was used to connect a chip to a package, like the early, early days of dual-in-line (DIP) ceramic and plastic packaging. But today, wire bonding is being performed in microelectronics cleanrooms in PCB assembly and manufacturing areas. […]

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Understand Wire Bonding and Die Shear Testing

Wire bonding, as shown in Fig. 1, and die shear strength training are inextricably intertwined. Die shear strength is a demanding aspect of wire bonding to assure top quality and reliability to comply with Mil STD 883, Rev. G or Rev. F. In particular, wire bonding and die shear strength testing play prominent roles for […]

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Ensure IoT device reliability via die shear strength testing

My last post dealt with IoT printed circuit board wire bond reliability and making sure wire bond connections are properly performed between a bare chip and the PCB or substrate. Beyond that particular subject, there is also so much more technology associated with IoT devices and reliability. Die shear strength is one area demanding increasing […]

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Pinpoint IoT PCB wire bonding reliability

IoT devices are spreading into a variety of markets well beyond the consumer area. These small to medium-size devices are finding their niche in industrial, military aerospace, medical and other associated areas. In such mission-critical applications, the top requirements are for reliability and ruggedness. IoT devices must be well-built and able to withstand considerable wear […]

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Get On the Right Wavelength for RF

RF circuits are designed to pass signals within a certain band. They use band pass filters to transmit signals in a so-called band of interest. The signal within a range of frequency passes through this band range, and the rest of the frequencies of the signal are filtered. A single band can be very narrow […]

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Get An Understanding of Wire Bonding Reliability

Wire bonding has been inextricably linked to semiconductor assembly and connecting the chip with its package. Today, wire bonding technology is used in PCB assembly simply because OEM demands are for increasingly smaller products and the boards they’re based on. Products like IoT devices and wearables are based on small rigid or a combination of […]

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Get your wires straight for IoT

Technical terms are used extensively — and sometimes misused — when it comes to IoT devices and the technologies they are rapidly absorbing. One such term is microelectronics, spoken and written about since the day the transistor was invented. Today, microelectronics takes on another name — namely wire bonding, which again isn’t a new technology […]

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Taking Another Look At ISO 13485

ISO 13485 is about potential risks involved and mitigating them during and after the building of medical products. It is a specific ISO standard serving as a comprehensive management system for the design and manufacture of medical devices. Like other ISO standards, its focus is on continuous improvement in process and quality systems. Also, a […]

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NexLogic Technologies, Inc. Named Among Top 10 EMS Providers in Silicon Valley by VentureOutsource

NexLogic Technologies, Inc. is a full service EMS Provider including printed circuit board (PCB) design, fabrication, assembly and manufacturing, and microelectronics assemblies. The company serves commercial, mil/aero, medical electronics, and consumer markets. Its OEM, ODM and semiconductor company customers partner with NexLogic on their conventional, automatic testing equipment (ATE), wearable, and IoT PCBs. Continue reading

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