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Anatomy of next-gen IoT PCBs

Next-generation IoT printed circuit boards are taking on a completely different anatomy than conventional PCBs thanks to a group of technologies that savvy IoT PCB houses are deploying. The whole idea behind these technologies is to meet the size, performance, reliability and cost demands of advanced IoT devices.

These technologies include:

  • High-density interconnect (HDI),
  • Micro via,
  • Multi-chip modules (MCMs),
  • Direct die attach on the substrate, and
  • Package-on-package (PoP).

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