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Embedded: Making efficient use of BGA signal routing in PCB designs

Ball grid array (BGA) device packaging is today’s standard for housing a range of highly advanced and complex semiconductor devices like FPGAs and microprocessors. The technology of BGA packaging for embedded designs is steadily advancing to keep up with chipmaker technical advances, with this type of packaging splintering out into standard and micro BGAs. Today, both types deal with increasing numbers of I/Os, and this means signal escape routing is difficult and challenging, even for experienced printed circuit board (PCB) and embedded designers…

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