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Printed Circuit Design & Fab: Characteristics of a Third-Level PCB Assembly

By and large, PCB assembly up to now has been rather traditional. Surface mount technology has made significant inroads to account for the greater majority of assembly technology compared to through-hole.

However, these days PCB assembly takes on new levels of technology, complexity and service requirements differently. At level one, OEMs require standard assemblies based on standard, defined processes and expect 100% yields, or close to them…

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