Printed Circuit Design & Fab: Design Practices for Panelization and Depanelization
Panelization, also known as the processing of boards in an array format, keeps small boards attached to each other within a single, larger substrate. Panelization is used to process multiple small boards through assembly, and is becoming more prevalent as board sizes shrink.
There are two primary reasons for using an array scheme: One is to increase throughput, and the other to permit the downstream manufacturing processes to maintain their standard panel sizes. Designing several smaller boards onto a standard 18 x 24″ panel permits the fabricator and EMS to use common fixtures for efficient handling, printing, placement and reflow.