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Embedded: Seven ways to avoid embedded PCB engineering change orders

Engineering change orders (ECOs) drive up design costs and result in numerous delays in product development that in turn result in costly extension of time to market. However, most ECOs can be avoided by paying careful attention to seven critical areas where problems frequently occur: component selection, memory, moisture sensitivity levels (MSL), design for test (DFT), cooling methodologies, heat sinks, and coefficient of thermal expansion (CTE).

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