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EET Asia: Saving embedded PCB design with forensic tech

Ever shrinking printed circuit boards (PCBs) populated with greater numbers of package-on-package (PoP) devices have made it more challenging for design engineers to find causes of system failures. After spending many hours or days trying to uncover design defects and flaws using traditional methods such as automated optical inspection (AOI) or x-ray, design engineers may simply give up and discard their designs, losing the time and considerable money they’ve invested in them, simply because they cannot locate the culprit making their designs inoperable.

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