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Stepping Out With 0.4mm Pitch BGA/PoPs

Package-on-package is a method of stacking components atop one another. Some OEMs use PoP to reduce the board real estate area, particularly for small handheld products and devices. Others are moving to PoP because end-markets demand greater performance in smaller systems and products. In either case, OEMs will find that there’s a game changer going from 0.5mm pitch BGA PoP to the next generation, 0.4mm ultra-fine pitch BGA PoP.

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