Underfill revisited: How a decades-old technique enables smaller, more durable PCBs
A well-orchestrated PCB design and assembly plan is required to successfully implement techniques such as underfill in next generation OEM embedded consumer and mobile designs.
Two distinct market sectors in embedded systems are driving a trend to ever smaller components that do more, do it more reliably, and do it while withstanding harsh conditions. In the consumer sector, both smaller size and increased functional densities are required for handheld, mobile, and portable systems, such as smart phones and tablets. In mil/aero portable electronics–such as satellites; unmanned aerial, undersea, and ground vehicles; and handheld, man pack, and small-form-factor battery-operated systems–ultra-reliability combined with the ability to withstand extreme temperatures and other environmental stresses are required in addition to greater functionality and reduced form factors.