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Taking on the 0.3 mm Ultra-Fine Pitch Device Challenge in PCB Design

A significant majority of the electronics OEM market is rapidly moving toward increasingly greater product miniaturization along with higher levels of functional integration.

The best examples are the new crops of smart phones and mobile/wireless devices. And whether the industry is ready or not, 0.3 millimeter (mm) ultra-fine pitch micro CSPs (chipscale packages), micro BGAs (ball grid arrays), and other active devices are quickly being ushered in to lead the designs of newer generations of thinner, faster, and sleeker portable, handheld electronics and communications devices.

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