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New Materials and Techniques Tackle PCB Thermal Management

Chipmakers do their part. But at the printed circuit board level, using the right mix of old and new materials effectively ushers out increasing heat.

New thermal management materials and techniques are being applied to subsystem PCB designs to meet heat dissipation demands introduced by new generations of mostly analog and some digital ICs that dissipate high current and high power. Thermal management focuses on effectively dissipating heat generated by those high-power designs, on high thermal conductivity, and on maintaining low coefficients of thermal expansion (CTE), while managing CTE mismatches between components, their interconnects and the PCB.

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