Home » Resource Center » Get On Board With Component Placement

Get On Board With Component Placement

Component placement isn’t what it used to be. Within a very short period recently, demands for:

  • Greater PCB functionality
  • Use of more advanced technologies
  • And customer requirements for smaller, more compact, and more densely populated designs

Place new challenges on component placement. The thing to keep in mind is that component placement has a direct effect on your OEM products at PCB fabrication and assembly.

Unless properly dealt with, placement issues can subsequently lead to costly headaches for your OEM products. Therefore, it’s a good idea from a business perspective to lean more toward seasoned contract manufacturers (CMs) who know their stuff. Handling these placement challenges and successfully resolving them require experience and savvy engineers and technicians.

Unlike some other CMs in our business, we possess that know-how because our design and assembly engineers work at the leading edge of advanced technologies and have a firm grasp of these problematic areas.

Learn more about correct component placement. Mark your calendar to read the upcoming February issue of Circuits Assembly Magazine to get more detail on placement.

In the meantime, we want to share with you some of the technical expertise we’ve gained by working in this area. Here are a few placement tips you want to keep in mind when moving to next generation designs.

  • Avoid placing noise-generating devices close to the clock to avoid signal interference.
  • Assure space limitations arenĂ­t violated when using through-hole or surface mount I/O components.
  • Accurately calculate physical DFA-related locations and dimensions, allowing I/O components to precisely communicate with associated systems and sub-systems.
  • Fully understand the pros and cons of different vias to avoid DFA issues.
  • Correctly place bypass capacitors next to BGA, QFN, and CSP devices. This is especially important in high-speed designs.
  • Assure your CM deploys first article inspection (FAI) to ensure all components are properly placed with correct orientation and polarities.

The evolution of various PCB technologies is introducing new meanings, dimensions, and demands for component placement. In particular, OEMs are escalating the use of popular fine pitch BGAs that challenge current design and assembly placement practices. These advanced components demand special consideration at placement That’s why it is critical to favor experience and know-how in this space.