Tracking the Flow of Solder Defects
Soldering defects can occur from reflow, wave, or hand soldering. However, the most prone to defects is reflow soldering for SMT. Reflow soldering is more complex compared to other forms of soldering. Reflow soldering requires the development and use of a correct thermal profile. Most often, the usual industry practice is to develop a thermal profile recipe for small, medium, and large boards. Depending on the assembly job, one of these three profiles is selected for reflow soldering, and assembly is performed using this scheme. But this is not the proper method, and can result in an unusually higher numbers of solder defects open solders, cold solders, or a combination of the two.