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Processes for Building Test Boards

Migrating from manual to automated assembly and test.

Semiconductor companies pour millions of dollars into developing state-of-the-art chips like multi-core microprocessors, DSPs, FPGAs, ASICs, DRAMs and flash, among others. Semiconductor testing always has proven challenging. But as chips get more complex and smaller, the difficulties become even more apparent, both in cost and time. Successfully testing these advanced chips results in direct revenue for the company. Therefore, it often has high visibility from high-level management. That puts an enormous amount of pressure on test engineers to produce results, and they, in turn, rush their vendors, often pushing them up to and beyond their limits. As a result, extreme challenges are created for EMS firms involved in the assembly of ATE load boards.

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