Anatomy of a Correct Thermal Profile
Complex, BGA-laden PCBs demand one-of-a-kind profiles.
PCBs laden with BGAs, some on both the component and solder sides of the board, are a challenge to thermally profile. And not only are PCBs increasingly populated with challenging BGA packages, but they are becoming more dense and smaller to comply with portable and wireless applications. Add to that the vast number of board sizes.
All of this demands special attention to thermal profiling, regardless of the end-application. In fact, each board requires a unique thermal profile. This also means different profiles for eutectic SnPb and Pb-free solder pastes. Special care must be taken in creating these profiles, as Pb-free solders require a higher peak temperature compared to eutectic solder.