Challenges in PCB Layout, Fab, and Assembly for Mobile Technology
OEMs continue requiring greater functionality in smaller portable and handheld products. As a result, a number of attributes are continuously demanded for PCBs in mobile technologies. Along with these attributes come a host of challenges in terms of layout, fabrication, and assembly, as well as assuring many of these handheld and portable devices can efficiently withstand mechanical vibrations.
For starters, due to the compact assemblies, top and bottom sides of small PCBs must be used because board real estate is minimal. Most often than not, small form-factor boards are populated with BGAs, micro BGAs, CSPs, QFNs, and other advanced chip packaging. It’s also worth noting that extra-fine pitch CSP devices are being increasingly used for mobile technologies. Those challenges start with layout, but continue on to fabrication and assembly. The common thread running through each stage is close coordination to avoid costly pitfalls.