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‘MicroBGA Design, Fab, and Assembly’ & PCBWest Workshop, Santa Clara Marriott

Mark your calendars for Wednesday September 16 at 9 to 11 am for NexLogic’s wide-ranging and detailed discussion on design, fab, and assembly dealing with microBGAs ñ one of the most challenging aspects of advanced PCBs today. Come learn how to start transitioning your earlier designs into more advanced ones exploiting the advantages of the microBGA.

MicroBGAs are among the most advanced devices and are quickly becoming the package of choice for PCB designers. These device packages have highly challenging 0.4-, 0.3- and even 0.25mm pitch. Advantages include package size reduction and allowing a board to be tightly packed with more functionality. However, for effective PCB designs based on microBGAs, OEMs should move in the direction of experienced and savvy EMS providers. Here are key benefits and tips to help you get a better handle on microBGAs.

  • Much improved chip delay performance compared to other technologies.
  • Provide lower inductance/impedance path to all signals.
  • MicroBGAs have low resistance, capacitance, and inductance of the short beam leads.
  • Fan-out and routing experience is foremost for efficient layout.
  • Avoid high-end fabrication requirements by assuring there are no routing complications.
  • If your PCB design house encourages dog-bone fan-out, look elsewhere.
  • All components around the microBGA should have 20 to 25mm clearance for re-work to prevent damage to them.

Also, it’s necessary that printing equipment be properly calibrated and quality paste be used in the assembly. Furthermore, a properly designed PCB layout includes considerations for all fabrication and assembly problems. This approach considerably helps to successfully finalize a microBGA project and achieve higher yield.