Designing with MicroBGAs
MicroBGAs provide electrical and physical advantages at the cost of increased design and manufacturing complexity.
The micro-ball grid array is one of the most advanced surface mount devices and is quickly becoming the package of choice for the electronic circuit designer. A microBGA is a subclass of the generic ball grid array (BGA). Typical BGA packages have ball-to-ball spacing of 1.0 mm or 0.8 mm, whereas typical microBGA packages have a pitch of about 0.4 mm or less. This permits package size reduction, among other advantages, plus microBGAs can be placed in close proximity on a printed circuit board (PCB).