Home » Technical Publications » The Big Deal Over Fine Pitch Assembly

The Big Deal Over Fine Pitch Assembly

The role fine pitch surface mount (SM) devices play in subassemblies is considerably more critical now than ever before. At 20 mils (0.5 mm) or less, fine pitch demands a well thought-out and orchestrated balance involving PCB design, fabrication, assembly, placement, and careful rework on SMD pads.

Otherwise, disjointed operations quickly usher in major challenges and issues. At the start, for instance, oversights at design layout can create a domino effect. That’s especially damaging in terms of excessive time and increased cost to OEMs who opt to rely on different design, fabrication, and assembly vendors with little to no coordination for this important aspect of fine pitch design.

Read More