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The Ins and Outs of BGA Reballing

BGA reballing takes on increased significance as OEM designers continue to populate PCBs with greater numbers of BGA-packaged devices such as FPGAs and other highly integrated components. Extremely high speed and expensive BGA devices like FPGAs cost in the range of $2,500 per part, sometimes even more. Therefore, when a BGA’s balls are inadvertently damaged during assembly, it is more prudent and economical to perform re-balling than to discard the entire BGA. This is especially true for expensive components like FPGAs and microprocessors.

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