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Ball Grid Array Soldering

Well made solder-printing stencils are critical to creating high-quality BGA assemblies. The larger of the two stencils above is framed. The smaller stencil is non-framed.

Assembling a printed circuit board (PCB) assembly populated with ball-grid array (BGA) packages requires the utmost precision, especially in the case of micro-BGAs. Component placement tolerances must be remarkably tight, and the right kind of flux is critical, because the method of activating the flux determines the reliability of the solder joints. The dispensing method used to control the amount of solder paste on the BGA pads also plays a critical role in avoiding solder defects.

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